JP2522457Y2 - 表面実装形電子部品 - Google Patents
表面実装形電子部品Info
- Publication number
- JP2522457Y2 JP2522457Y2 JP1990107574U JP10757490U JP2522457Y2 JP 2522457 Y2 JP2522457 Y2 JP 2522457Y2 JP 1990107574 U JP1990107574 U JP 1990107574U JP 10757490 U JP10757490 U JP 10757490U JP 2522457 Y2 JP2522457 Y2 JP 2522457Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- substrate
- leads
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990107574U JP2522457Y2 (ja) | 1990-10-16 | 1990-10-16 | 表面実装形電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990107574U JP2522457Y2 (ja) | 1990-10-16 | 1990-10-16 | 表面実装形電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0465453U JPH0465453U (US20090177143A1-20090709-C00008.png) | 1992-06-08 |
JP2522457Y2 true JP2522457Y2 (ja) | 1997-01-16 |
Family
ID=31854162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990107574U Expired - Fee Related JP2522457Y2 (ja) | 1990-10-16 | 1990-10-16 | 表面実装形電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2522457Y2 (US20090177143A1-20090709-C00008.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013222781A (ja) * | 2012-04-16 | 2013-10-28 | Sharp Corp | 半導体装置のデバイス実装構造 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61279154A (ja) * | 1985-06-05 | 1986-12-09 | Toshiba Corp | 基板実装用電子部品 |
JPS6367763A (ja) * | 1986-09-09 | 1988-03-26 | Nec Corp | 半導体装置 |
-
1990
- 1990-10-16 JP JP1990107574U patent/JP2522457Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0465453U (US20090177143A1-20090709-C00008.png) | 1992-06-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |