JP2521489Y2 - パワーモジュールの放熱構造 - Google Patents
パワーモジュールの放熱構造Info
- Publication number
- JP2521489Y2 JP2521489Y2 JP10646690U JP10646690U JP2521489Y2 JP 2521489 Y2 JP2521489 Y2 JP 2521489Y2 JP 10646690 U JP10646690 U JP 10646690U JP 10646690 U JP10646690 U JP 10646690U JP 2521489 Y2 JP2521489 Y2 JP 2521489Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- circuit board
- power module
- support member
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 18
- 230000005855 radiation Effects 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Transformer Cooling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10646690U JP2521489Y2 (ja) | 1990-10-09 | 1990-10-09 | パワーモジュールの放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10646690U JP2521489Y2 (ja) | 1990-10-09 | 1990-10-09 | パワーモジュールの放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463622U JPH0463622U (cs) | 1992-05-29 |
| JP2521489Y2 true JP2521489Y2 (ja) | 1996-12-25 |
Family
ID=31852569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10646690U Expired - Lifetime JP2521489Y2 (ja) | 1990-10-09 | 1990-10-09 | パワーモジュールの放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2521489Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6460477B2 (ja) * | 2015-04-03 | 2019-01-30 | オムロンオートモーティブエレクトロニクス株式会社 | 電子機器 |
-
1990
- 1990-10-09 JP JP10646690U patent/JP2521489Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0463622U (cs) | 1992-05-29 |
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