JP2521488Y2 - リードフォーミング装置 - Google Patents

リードフォーミング装置

Info

Publication number
JP2521488Y2
JP2521488Y2 JP1990098279U JP9827990U JP2521488Y2 JP 2521488 Y2 JP2521488 Y2 JP 2521488Y2 JP 1990098279 U JP1990098279 U JP 1990098279U JP 9827990 U JP9827990 U JP 9827990U JP 2521488 Y2 JP2521488 Y2 JP 2521488Y2
Authority
JP
Japan
Prior art keywords
lead forming
lower frame
piece
tape carrier
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990098279U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0456338U (OSRAM
Inventor
佳央 伊藤
Original Assignee
セイコー電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコー電子工業株式会社 filed Critical セイコー電子工業株式会社
Priority to JP1990098279U priority Critical patent/JP2521488Y2/ja
Publication of JPH0456338U publication Critical patent/JPH0456338U/ja
Application granted granted Critical
Publication of JP2521488Y2 publication Critical patent/JP2521488Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1990098279U 1990-09-19 1990-09-19 リードフォーミング装置 Expired - Lifetime JP2521488Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990098279U JP2521488Y2 (ja) 1990-09-19 1990-09-19 リードフォーミング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990098279U JP2521488Y2 (ja) 1990-09-19 1990-09-19 リードフォーミング装置

Publications (2)

Publication Number Publication Date
JPH0456338U JPH0456338U (OSRAM) 1992-05-14
JP2521488Y2 true JP2521488Y2 (ja) 1996-12-25

Family

ID=31839334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990098279U Expired - Lifetime JP2521488Y2 (ja) 1990-09-19 1990-09-19 リードフォーミング装置

Country Status (1)

Country Link
JP (1) JP2521488Y2 (OSRAM)

Also Published As

Publication number Publication date
JPH0456338U (OSRAM) 1992-05-14

Similar Documents

Publication Publication Date Title
JP2521488Y2 (ja) リードフォーミング装置
CN211267282U (zh) 一种线路板钻孔加工用定位板结构
JP2818669B2 (ja) Ｌｅｄのハンダ付け用治具とハンダ付け方法
JPH0338089A (ja) Ｉｃの固定方法
CN217965415U (zh) 一种激光切割定位装置
JP2713621B2 (ja) チップ部品の実装方法
JPH0810240Y2 (ja) 電子部品装着用治具
JPH0215360Y2 (OSRAM)
JPS63136691A (ja) ピンのハンダ付方法
JPS5990508U (ja) ボ−ル盤用穴明位置設定装置
JPH0426545U (OSRAM)
JPS6228117Y2 (OSRAM)
GB1249067A (en) Improvements in or relating to methods of connecting integrated circuit chips to printed circuit boards
JP2551297Y2 (ja) トランジスタ取付ホルダ
JPS5846549Y2 (ja) リ−ドレスパッケ−ジ用ソケットの構造
JPH03112143A (ja) 半導体素子の試験用ソケット
JPS6060156U (ja) 半田付キヤリア
JPS6356984A (ja) プリント基板の製造方法
JPS62269393A (ja) 回路基板モジユ−ルのパタ−ン印刷方法
JPH06244347A (ja) 半導体部品の実装構造
JPS6344480U (OSRAM)
JPH01310594A (ja) Ｉｃパッケージ実装装置
JPH0376691A (ja) 部品実装基板
JPH01124289A (ja) プレス部品を用いた実装方法
JPH0548294A (ja) 表面実装部品の実装方法