JP2515659Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2515659Y2
JP2515659Y2 JP1990083676U JP8367690U JP2515659Y2 JP 2515659 Y2 JP2515659 Y2 JP 2515659Y2 JP 1990083676 U JP1990083676 U JP 1990083676U JP 8367690 U JP8367690 U JP 8367690U JP 2515659 Y2 JP2515659 Y2 JP 2515659Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
metal layer
insulating substrate
package
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990083676U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442731U (enExample
Inventor
公明 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990083676U priority Critical patent/JP2515659Y2/ja
Publication of JPH0442731U publication Critical patent/JPH0442731U/ja
Application granted granted Critical
Publication of JP2515659Y2 publication Critical patent/JP2515659Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1990083676U 1990-08-07 1990-08-07 半導体素子収納用パッケージ Expired - Fee Related JP2515659Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990083676U JP2515659Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990083676U JP2515659Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0442731U JPH0442731U (enExample) 1992-04-10
JP2515659Y2 true JP2515659Y2 (ja) 1996-10-30

Family

ID=31631538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990083676U Expired - Fee Related JP2515659Y2 (ja) 1990-08-07 1990-08-07 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2515659Y2 (enExample)

Also Published As

Publication number Publication date
JPH0442731U (enExample) 1992-04-10

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Legal Events

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