JPH0442731U - - Google Patents
Info
- Publication number
- JPH0442731U JPH0442731U JP1990083676U JP8367690U JPH0442731U JP H0442731 U JPH0442731 U JP H0442731U JP 1990083676 U JP1990083676 U JP 1990083676U JP 8367690 U JP8367690 U JP 8367690U JP H0442731 U JPH0442731 U JP H0442731U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal layer
- semiconductor element
- insulating substrate
- glass material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083676U JP2515659Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083676U JP2515659Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442731U true JPH0442731U (enExample) | 1992-04-10 |
| JP2515659Y2 JP2515659Y2 (ja) | 1996-10-30 |
Family
ID=31631538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083676U Expired - Fee Related JP2515659Y2 (ja) | 1990-08-07 | 1990-08-07 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515659Y2 (enExample) |
-
1990
- 1990-08-07 JP JP1990083676U patent/JP2515659Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515659Y2 (ja) | 1996-10-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |