JPH045651U - - Google Patents

Info

Publication number
JPH045651U
JPH045651U JP1990045838U JP4583890U JPH045651U JP H045651 U JPH045651 U JP H045651U JP 1990045838 U JP1990045838 U JP 1990045838U JP 4583890 U JP4583890 U JP 4583890U JP H045651 U JPH045651 U JP H045651U
Authority
JP
Japan
Prior art keywords
recess
insulating base
semiconductor device
package
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990045838U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990045838U priority Critical patent/JPH045651U/ja
Publication of JPH045651U publication Critical patent/JPH045651U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
JP1990045838U 1990-04-27 1990-04-27 Pending JPH045651U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990045838U JPH045651U (enExample) 1990-04-27 1990-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990045838U JPH045651U (enExample) 1990-04-27 1990-04-27

Publications (1)

Publication Number Publication Date
JPH045651U true JPH045651U (enExample) 1992-01-20

Family

ID=31560371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990045838U Pending JPH045651U (enExample) 1990-04-27 1990-04-27

Country Status (1)

Country Link
JP (1) JPH045651U (enExample)

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