JPH0363944U - - Google Patents
Info
- Publication number
- JPH0363944U JPH0363944U JP1989125452U JP12545289U JPH0363944U JP H0363944 U JPH0363944 U JP H0363944U JP 1989125452 U JP1989125452 U JP 1989125452U JP 12545289 U JP12545289 U JP 12545289U JP H0363944 U JPH0363944 U JP H0363944U
- Authority
- JP
- Japan
- Prior art keywords
- package
- external connection
- large number
- connection terminals
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125452U JPH0363944U (enExample) | 1989-10-26 | 1989-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125452U JPH0363944U (enExample) | 1989-10-26 | 1989-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363944U true JPH0363944U (enExample) | 1991-06-21 |
Family
ID=31673322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989125452U Pending JPH0363944U (enExample) | 1989-10-26 | 1989-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363944U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011160009A (ja) * | 1996-03-28 | 2011-08-18 | Intel Corp | 基板とこの基板の第１の面に搭載される集積回路ダイとの間の熱膨張差による応力を低減する方法 |
| JP2018093230A (ja) * | 2018-03-05 | 2018-06-14 | 東芝メモリ株式会社 | ストレージ装置、及び電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151443A (ja) * | 1983-02-17 | 1984-08-29 | Fujitsu Ltd | 半導体装置 |
-
1989
- 1989-10-26 JP JP1989125452U patent/JPH0363944U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151443A (ja) * | 1983-02-17 | 1984-08-29 | Fujitsu Ltd | 半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011160009A (ja) * | 1996-03-28 | 2011-08-18 | Intel Corp | 基板とこの基板の第１の面に搭載される集積回路ダイとの間の熱膨張差による応力を低減する方法 |
| JP2018093230A (ja) * | 2018-03-05 | 2018-06-14 | 東芝メモリ株式会社 | ストレージ装置、及び電子機器 |