JPH0363945U - - Google Patents
Info
- Publication number
- JPH0363945U JPH0363945U JP1989125455U JP12545589U JPH0363945U JP H0363945 U JPH0363945 U JP H0363945U JP 1989125455 U JP1989125455 U JP 1989125455U JP 12545589 U JP12545589 U JP 12545589U JP H0363945 U JPH0363945 U JP H0363945U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- package
- recess
- semiconductor element
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125455U JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125455U JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363945U true JPH0363945U (enExample) | 1991-06-21 |
| JPH0723965Y2 JPH0723965Y2 (ja) | 1995-05-31 |
Family
ID=31673325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989125455U Expired - Lifetime JPH0723965Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723965Y2 (enExample) |
-
1989
- 1989-10-26 JP JP1989125455U patent/JPH0723965Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723965Y2 (ja) | 1995-05-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |