JPH0187547U - - Google Patents
Info
- Publication number
- JPH0187547U JPH0187547U JP1987182909U JP18290987U JPH0187547U JP H0187547 U JPH0187547 U JP H0187547U JP 1987182909 U JP1987182909 U JP 1987182909U JP 18290987 U JP18290987 U JP 18290987U JP H0187547 U JPH0187547 U JP H0187547U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting structure
- metal base
- semiconductor
- shaped groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182909U JPH0187547U (enExample) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987182909U JPH0187547U (enExample) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187547U true JPH0187547U (enExample) | 1989-06-09 |
Family
ID=31474349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987182909U Pending JPH0187547U (enExample) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187547U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0472638U (enExample) * | 1990-10-31 | 1992-06-26 | ||
| JP2010251457A (ja) * | 2009-04-14 | 2010-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
-
1987
- 1987-12-02 JP JP1987182909U patent/JPH0187547U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03145748A (ja) * | 1989-10-31 | 1991-06-20 | Narumi China Corp | セラミックス回路基板 |
| JPH0472638U (enExample) * | 1990-10-31 | 1992-06-26 | ||
| JP2010251457A (ja) * | 2009-04-14 | 2010-11-04 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |