JPH0412637U - - Google Patents
Info
- Publication number
- JPH0412637U JPH0412637U JP1990054230U JP5423090U JPH0412637U JP H0412637 U JPH0412637 U JP H0412637U JP 1990054230 U JP1990054230 U JP 1990054230U JP 5423090 U JP5423090 U JP 5423090U JP H0412637 U JPH0412637 U JP H0412637U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting section
- powder
- metal base
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990054230U JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990054230U JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412637U true JPH0412637U (enExample) | 1992-01-31 |
| JP2510585Y2 JP2510585Y2 (ja) | 1996-09-11 |
Family
ID=31576111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990054230U Expired - Lifetime JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510585Y2 (enExample) |
-
1990
- 1990-05-24 JP JP1990054230U patent/JP2510585Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510585Y2 (ja) | 1996-09-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |