JP2512626Y2 - 樹脂封止形光半導体装置 - Google Patents

樹脂封止形光半導体装置

Info

Publication number
JP2512626Y2
JP2512626Y2 JP1990086772U JP8677290U JP2512626Y2 JP 2512626 Y2 JP2512626 Y2 JP 2512626Y2 JP 1990086772 U JP1990086772 U JP 1990086772U JP 8677290 U JP8677290 U JP 8677290U JP 2512626 Y2 JP2512626 Y2 JP 2512626Y2
Authority
JP
Japan
Prior art keywords
lead
wide
resin
narrow
narrow portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990086772U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444171U (https=
Inventor
明 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1990086772U priority Critical patent/JP2512626Y2/ja
Publication of JPH0444171U publication Critical patent/JPH0444171U/ja
Application granted granted Critical
Publication of JP2512626Y2 publication Critical patent/JP2512626Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1990086772U 1990-08-21 1990-08-21 樹脂封止形光半導体装置 Expired - Fee Related JP2512626Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Publications (2)

Publication Number Publication Date
JPH0444171U JPH0444171U (https=) 1992-04-15
JP2512626Y2 true JP2512626Y2 (ja) 1996-10-02

Family

ID=31818609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086772U Expired - Fee Related JP2512626Y2 (ja) 1990-08-21 1990-08-21 樹脂封止形光半導体装置

Country Status (1)

Country Link
JP (1) JP2512626Y2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781787B2 (en) * 2001-11-16 2010-08-24 Toyoda Gosei, Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
JP2007019153A (ja) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd 光リンクデバイス
JP5556369B2 (ja) * 2010-05-25 2014-07-23 日亜化学工業株式会社 発光装置及びそれを用いた表示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62209Y2 (https=) * 1980-05-26 1987-01-07
JPH0247070U (https=) * 1988-09-28 1990-03-30

Also Published As

Publication number Publication date
JPH0444171U (https=) 1992-04-15

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