JP2511979Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2511979Y2
JP2511979Y2 JP983988U JP983988U JP2511979Y2 JP 2511979 Y2 JP2511979 Y2 JP 2511979Y2 JP 983988 U JP983988 U JP 983988U JP 983988 U JP983988 U JP 983988U JP 2511979 Y2 JP2511979 Y2 JP 2511979Y2
Authority
JP
Japan
Prior art keywords
control element
semiconductor device
filler
heat
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP983988U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01115255U (bg
Inventor
弘之 山本
肇 出口
亨 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP983988U priority Critical patent/JP2511979Y2/ja
Publication of JPH01115255U publication Critical patent/JPH01115255U/ja
Application granted granted Critical
Publication of JP2511979Y2 publication Critical patent/JP2511979Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP983988U 1988-01-27 1988-01-27 半導体装置 Expired - Lifetime JP2511979Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP983988U JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP983988U JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH01115255U JPH01115255U (bg) 1989-08-03
JP2511979Y2 true JP2511979Y2 (ja) 1996-09-25

Family

ID=31216938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP983988U Expired - Lifetime JP2511979Y2 (ja) 1988-01-27 1988-01-27 半導体装置

Country Status (1)

Country Link
JP (1) JP2511979Y2 (bg)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002373929A (ja) * 2001-06-14 2002-12-26 Tokyo Electron Ltd ウエハ支持体
JP5120032B2 (ja) * 2008-04-03 2013-01-16 株式会社デンソー 電子装置
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740966A (en) * 1980-08-25 1982-03-06 Hitachi Ltd Semiconductor device
JPS6037248U (ja) * 1983-08-19 1985-03-14 富士電機株式会社 混成集積回路

Also Published As

Publication number Publication date
JPH01115255U (bg) 1989-08-03

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