JPH01115255U - - Google Patents
Info
- Publication number
- JPH01115255U JPH01115255U JP983988U JP983988U JPH01115255U JP H01115255 U JPH01115255 U JP H01115255U JP 983988 U JP983988 U JP 983988U JP 983988 U JP983988 U JP 983988U JP H01115255 U JPH01115255 U JP H01115255U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- conductive part
- insulating sealant
- control element
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims 2
- 239000000565 sealant Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP983988U JP2511979Y2 (ja) | 1988-01-27 | 1988-01-27 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP983988U JP2511979Y2 (ja) | 1988-01-27 | 1988-01-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01115255U true JPH01115255U (bg) | 1989-08-03 |
JP2511979Y2 JP2511979Y2 (ja) | 1996-09-25 |
Family
ID=31216938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP983988U Expired - Lifetime JP2511979Y2 (ja) | 1988-01-27 | 1988-01-27 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2511979Y2 (bg) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002103781A1 (fr) * | 2001-06-14 | 2002-12-27 | Tokyo Electron Limited | Support de plaquette |
JP2009252886A (ja) * | 2008-04-03 | 2009-10-29 | Denso Corp | 電子装置 |
WO2019017283A1 (ja) * | 2017-07-21 | 2019-01-24 | 株式会社村田製作所 | 電子部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5740966A (en) * | 1980-08-25 | 1982-03-06 | Hitachi Ltd | Semiconductor device |
JPS6037248U (ja) * | 1983-08-19 | 1985-03-14 | 富士電機株式会社 | 混成集積回路 |
-
1988
- 1988-01-27 JP JP983988U patent/JP2511979Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5740966A (en) * | 1980-08-25 | 1982-03-06 | Hitachi Ltd | Semiconductor device |
JPS6037248U (ja) * | 1983-08-19 | 1985-03-14 | 富士電機株式会社 | 混成集積回路 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002103781A1 (fr) * | 2001-06-14 | 2002-12-27 | Tokyo Electron Limited | Support de plaquette |
JP2009252886A (ja) * | 2008-04-03 | 2009-10-29 | Denso Corp | 電子装置 |
WO2019017283A1 (ja) * | 2017-07-21 | 2019-01-24 | 株式会社村田製作所 | 電子部品 |
US11335617B2 (en) | 2017-07-21 | 2022-05-17 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP2511979Y2 (ja) | 1996-09-25 |
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