JP2509351Y2 - 配線基材 - Google Patents
配線基材Info
- Publication number
- JP2509351Y2 JP2509351Y2 JP1989128346U JP12834689U JP2509351Y2 JP 2509351 Y2 JP2509351 Y2 JP 2509351Y2 JP 1989128346 U JP1989128346 U JP 1989128346U JP 12834689 U JP12834689 U JP 12834689U JP 2509351 Y2 JP2509351 Y2 JP 2509351Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- base material
- adjacent
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128346U JP2509351Y2 (ja) | 1989-10-31 | 1989-10-31 | 配線基材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128346U JP2509351Y2 (ja) | 1989-10-31 | 1989-10-31 | 配線基材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0367433U JPH0367433U (en, 2012) | 1991-07-01 |
| JP2509351Y2 true JP2509351Y2 (ja) | 1996-09-04 |
Family
ID=31676058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128346U Expired - Lifetime JP2509351Y2 (ja) | 1989-10-31 | 1989-10-31 | 配線基材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509351Y2 (en, 2012) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025177A (en, 2012) * | 1973-07-05 | 1975-03-17 | ||
| JPH01119034A (ja) * | 1987-10-30 | 1989-05-11 | Ibiden Co Ltd | 電子部品搭載用フイルムキャリア |
-
1989
- 1989-10-31 JP JP1989128346U patent/JP2509351Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0367433U (en, 2012) | 1991-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |