JP2509095Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2509095Y2
JP2509095Y2 JP1990019874U JP1987490U JP2509095Y2 JP 2509095 Y2 JP2509095 Y2 JP 2509095Y2 JP 1990019874 U JP1990019874 U JP 1990019874U JP 1987490 U JP1987490 U JP 1987490U JP 2509095 Y2 JP2509095 Y2 JP 2509095Y2
Authority
JP
Japan
Prior art keywords
wiring board
lead
external lead
semiconductor device
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990019874U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03110857U (enExample
Inventor
久夫 新井
憲司 坊野
幸治 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chichibu Fuji Co Ltd
Original Assignee
Chichibu Fuji Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co Ltd filed Critical Chichibu Fuji Co Ltd
Priority to JP1990019874U priority Critical patent/JP2509095Y2/ja
Publication of JPH03110857U publication Critical patent/JPH03110857U/ja
Application granted granted Critical
Publication of JP2509095Y2 publication Critical patent/JP2509095Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990019874U 1990-02-28 1990-02-28 半導体装置 Expired - Lifetime JP2509095Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH03110857U JPH03110857U (enExample) 1991-11-13
JP2509095Y2 true JP2509095Y2 (ja) 1996-08-28

Family

ID=31522978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019874U Expired - Lifetime JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2509095Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184525A (ja) * 2005-12-07 2007-07-19 Mitsubishi Electric Corp 電子機器装置
JP2011023748A (ja) * 2005-12-07 2011-02-03 Mitsubishi Electric Corp 電子機器装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160261A (ja) * 1986-12-23 1988-07-04 Kyocera Corp リ−ド付き電子部品
JPH01136358A (ja) * 1987-11-24 1989-05-29 Hitachi Chem Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH03110857U (enExample) 1991-11-13

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