JPH03110857U - - Google Patents

Info

Publication number
JPH03110857U
JPH03110857U JP1990019874U JP1987490U JPH03110857U JP H03110857 U JPH03110857 U JP H03110857U JP 1990019874 U JP1990019874 U JP 1990019874U JP 1987490 U JP1987490 U JP 1987490U JP H03110857 U JPH03110857 U JP H03110857U
Authority
JP
Japan
Prior art keywords
semiconductor device
wiring board
lead
hole
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990019874U
Other languages
English (en)
Japanese (ja)
Other versions
JP2509095Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990019874U priority Critical patent/JP2509095Y2/ja
Publication of JPH03110857U publication Critical patent/JPH03110857U/ja
Application granted granted Critical
Publication of JP2509095Y2 publication Critical patent/JP2509095Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990019874U 1990-02-28 1990-02-28 半導体装置 Expired - Lifetime JP2509095Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH03110857U true JPH03110857U (enExample) 1991-11-13
JP2509095Y2 JP2509095Y2 (ja) 1996-08-28

Family

ID=31522978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019874U Expired - Lifetime JP2509095Y2 (ja) 1990-02-28 1990-02-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2509095Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184525A (ja) * 2005-12-07 2007-07-19 Mitsubishi Electric Corp 電子機器装置
JP2011023748A (ja) * 2005-12-07 2011-02-03 Mitsubishi Electric Corp 電子機器装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160261A (ja) * 1986-12-23 1988-07-04 Kyocera Corp リ−ド付き電子部品
JPH01136358A (ja) * 1987-11-24 1989-05-29 Hitachi Chem Co Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160261A (ja) * 1986-12-23 1988-07-04 Kyocera Corp リ−ド付き電子部品
JPH01136358A (ja) * 1987-11-24 1989-05-29 Hitachi Chem Co Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184525A (ja) * 2005-12-07 2007-07-19 Mitsubishi Electric Corp 電子機器装置
JP2011023748A (ja) * 2005-12-07 2011-02-03 Mitsubishi Electric Corp 電子機器装置

Also Published As

Publication number Publication date
JP2509095Y2 (ja) 1996-08-28

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term