JPH0339842U - - Google Patents
Info
- Publication number
- JPH0339842U JPH0339842U JP1989099888U JP9988889U JPH0339842U JP H0339842 U JPH0339842 U JP H0339842U JP 1989099888 U JP1989099888 U JP 1989099888U JP 9988889 U JP9988889 U JP 9988889U JP H0339842 U JPH0339842 U JP H0339842U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- wiring board
- printed wiring
- push
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5449—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989099888U JPH0339842U (enExample) | 1989-08-29 | 1989-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989099888U JPH0339842U (enExample) | 1989-08-29 | 1989-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339842U true JPH0339842U (enExample) | 1991-04-17 |
Family
ID=31648920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989099888U Pending JPH0339842U (enExample) | 1989-08-29 | 1989-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339842U (enExample) |
-
1989
- 1989-08-29 JP JP1989099888U patent/JPH0339842U/ja active Pending