JPH032635U - - Google Patents
Info
- Publication number
- JPH032635U JPH032635U JP6254489U JP6254489U JPH032635U JP H032635 U JPH032635 U JP H032635U JP 6254489 U JP6254489 U JP 6254489U JP 6254489 U JP6254489 U JP 6254489U JP H032635 U JPH032635 U JP H032635U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating substrate
- bonding pad
- printed wiring
- bare chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5449—
-
- H10W90/754—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6254489U JPH032635U (enExample) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6254489U JPH032635U (enExample) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032635U true JPH032635U (enExample) | 1991-01-11 |
Family
ID=31591791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6254489U Pending JPH032635U (enExample) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032635U (enExample) |
-
1989
- 1989-05-31 JP JP6254489U patent/JPH032635U/ja active Pending