JPH0179831U - - Google Patents
Info
- Publication number
- JPH0179831U JPH0179831U JP17623387U JP17623387U JPH0179831U JP H0179831 U JPH0179831 U JP H0179831U JP 17623387 U JP17623387 U JP 17623387U JP 17623387 U JP17623387 U JP 17623387U JP H0179831 U JPH0179831 U JP H0179831U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- bare chip
- semiconductor bare
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/013—
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- H10W72/30—
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- H10W72/073—
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- H10W72/075—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17623387U JPH0179831U (enExample) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17623387U JPH0179831U (enExample) | 1987-11-18 | 1987-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179831U true JPH0179831U (enExample) | 1989-05-29 |
Family
ID=31467978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17623387U Pending JPH0179831U (enExample) | 1987-11-18 | 1987-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179831U (enExample) |
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1987
- 1987-11-18 JP JP17623387U patent/JPH0179831U/ja active Pending