JPH0179832U - - Google Patents
Info
- Publication number
- JPH0179832U JPH0179832U JP17623487U JP17623487U JPH0179832U JP H0179832 U JPH0179832 U JP H0179832U JP 17623487 U JP17623487 U JP 17623487U JP 17623487 U JP17623487 U JP 17623487U JP H0179832 U JPH0179832 U JP H0179832U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- wiring board
- printed wiring
- bare chip
- semiconductor bare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17623487U JPH0179832U (enExample) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17623487U JPH0179832U (enExample) | 1987-11-18 | 1987-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179832U true JPH0179832U (enExample) | 1989-05-29 |
Family
ID=31467979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17623487U Pending JPH0179832U (enExample) | 1987-11-18 | 1987-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179832U (enExample) |
-
1987
- 1987-11-18 JP JP17623487U patent/JPH0179832U/ja active Pending