JPS60160550U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS60160550U
JPS60160550U JP5021884U JP5021884U JPS60160550U JP S60160550 U JPS60160550 U JP S60160550U JP 5021884 U JP5021884 U JP 5021884U JP 5021884 U JP5021884 U JP 5021884U JP S60160550 U JPS60160550 U JP S60160550U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
wiring board
base ribbon
pellet fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5021884U
Other languages
English (en)
Inventor
成田　万紀
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP5021884U priority Critical patent/JPS60160550U/ja
Publication of JPS60160550U publication Critical patent/JPS60160550U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は本考案の一実施例である混成集積回
路を示す平面図及び正面図、第３図及び第４図は従来の
混成集積回路を示す平面図及び正面図である。 ８・・・配線基板、９・・・配線パターン、１０・・・
ベースリボン、１０ａ・・・リード、１０ｃ・・・ヒー
トシンク部、ｌｌａ・・・信号用半導体ペレット、１１
ｂ。 １１ｃ・・・電力用半導体ペレット、１２・・・金属細
線、１３・・・モールド樹脂、１９・・・混成集積回路
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁性の配線基板に近接して配置された複数のリードか
    らなるベースリボンとを有し、配線基板及びベースリボ
    ンの一部を含む所要部を樹脂モールドしてなる混成集積
    回路において、信号用半導体ペレットを配線基板に固着
    し、電力用半導体ペレットをベースリボンに固着したこ
    とを特徴とす■　　る混成集積回路。
JP5021884U 1984-04-04 1984-04-04 混成集積回路 Pending JPS60160550U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5021884U JPS60160550U (ja) 1984-04-04 1984-04-04 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5021884U JPS60160550U (ja) 1984-04-04 1984-04-04 混成集積回路

Publications (1)

Publication Number Publication Date
JPS60160550U true JPS60160550U (ja) 1985-10-25

Family

ID=30568145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5021884U Pending JPS60160550U (ja) 1984-04-04 1984-04-04 混成集積回路

Country Status (1)

Country Link
JP (1) JPS60160550U (ja)

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