JPH0213728U - - Google Patents

Info

Publication number
JPH0213728U
JPH0213728U JP1988092294U JP9229488U JPH0213728U JP H0213728 U JPH0213728 U JP H0213728U JP 1988092294 U JP1988092294 U JP 1988092294U JP 9229488 U JP9229488 U JP 9229488U JP H0213728 U JPH0213728 U JP H0213728U
Authority
JP
Japan
Prior art keywords
resin
wiring board
integrated circuit
hybrid integrated
insulating wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988092294U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988092294U priority Critical patent/JPH0213728U/ja
Publication of JPH0213728U publication Critical patent/JPH0213728U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/01308
    • H10W72/07311
    • H10W90/734

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1988092294U 1988-07-11 1988-07-11 Pending JPH0213728U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988092294U JPH0213728U (enExample) 1988-07-11 1988-07-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988092294U JPH0213728U (enExample) 1988-07-11 1988-07-11

Publications (1)

Publication Number Publication Date
JPH0213728U true JPH0213728U (enExample) 1990-01-29

Family

ID=31316741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988092294U Pending JPH0213728U (enExample) 1988-07-11 1988-07-11

Country Status (1)

Country Link
JP (1) JPH0213728U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181166A (ja) * 1994-12-22 1996-07-12 Ibiden Co Ltd プリント配線板

Similar Documents

Publication Publication Date Title
JPH0213728U (enExample)
JPH0249140U (enExample)
JPS63187330U (enExample)
JPH0268452U (enExample)
JPS6316455U (enExample)
JPS6284970U (enExample)
JPH0336478U (enExample)
JPS61140574U (enExample)
JPS62188144U (enExample)
JPS6166955U (enExample)
JPH03115407U (enExample)
JPS62184782U (enExample)
JPH0365275U (enExample)
JPS63164239U (enExample)
JPH0262734U (enExample)
JPS62122354U (enExample)
JPH02146437U (enExample)
JPS5895054U (ja) 半導体装置
JPS6430878U (enExample)
JPH0396047U (enExample)
JPS60118242U (ja) Icチツプ用パツケ−ジ
JPS63134548U (enExample)
JPH01176946U (enExample)
JPH0451145U (enExample)
JPH0339842U (enExample)