JPH0396047U - - Google Patents

Info

Publication number
JPH0396047U
JPH0396047U JP1990004698U JP469890U JPH0396047U JP H0396047 U JPH0396047 U JP H0396047U JP 1990004698 U JP1990004698 U JP 1990004698U JP 469890 U JP469890 U JP 469890U JP H0396047 U JPH0396047 U JP H0396047U
Authority
JP
Japan
Prior art keywords
circuit board
integrated circuit
wiring pattern
multilayer circuit
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990004698U
Other languages
English (en)
Japanese (ja)
Other versions
JP2591999Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990004698U priority Critical patent/JP2591999Y2/ja
Publication of JPH0396047U publication Critical patent/JPH0396047U/ja
Application granted granted Critical
Publication of JP2591999Y2 publication Critical patent/JP2591999Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1990004698U 1990-01-22 1990-01-22 集積回路のパッケージの構造 Expired - Lifetime JP2591999Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990004698U JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990004698U JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Publications (2)

Publication Number Publication Date
JPH0396047U true JPH0396047U (enExample) 1991-10-01
JP2591999Y2 JP2591999Y2 (ja) 1999-03-10

Family

ID=31508432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990004698U Expired - Lifetime JP2591999Y2 (ja) 1990-01-22 1990-01-22 集積回路のパッケージの構造

Country Status (1)

Country Link
JP (1) JP2591999Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101234U (enExample) * 1985-12-16 1987-06-27
JPS6448039U (enExample) * 1987-09-21 1989-03-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101234U (enExample) * 1985-12-16 1987-06-27
JPS6448039U (enExample) * 1987-09-21 1989-03-24

Also Published As

Publication number Publication date
JP2591999Y2 (ja) 1999-03-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term