JPS6448039U - - Google Patents
Info
- Publication number
- JPS6448039U JPS6448039U JP1987143097U JP14309787U JPS6448039U JP S6448039 U JPS6448039 U JP S6448039U JP 1987143097 U JP1987143097 U JP 1987143097U JP 14309787 U JP14309787 U JP 14309787U JP S6448039 U JPS6448039 U JP S6448039U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic layer
- patterned
- ceramic
- inner lead
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W70/682—
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- H10W70/685—
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- H10W72/07554—
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- H10W72/547—
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- H10W72/884—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143097U JPS6448039U (enExample) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143097U JPS6448039U (enExample) | 1987-09-21 | 1987-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448039U true JPS6448039U (enExample) | 1989-03-24 |
Family
ID=31409612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143097U Pending JPS6448039U (enExample) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448039U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396047U (enExample) * | 1990-01-22 | 1991-10-01 | ||
| JPH06112359A (ja) * | 1992-09-30 | 1994-04-22 | Kyocera Corp | 電子部品搭載用回路基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5561041A (en) * | 1978-10-30 | 1980-05-08 | Mitsubishi Electric Corp | Packaging device for semiconductor integrated circuit |
| JPS55143045A (en) * | 1979-04-26 | 1980-11-08 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5651851A (en) * | 1979-10-05 | 1981-05-09 | Hitachi Ltd | Semiconductor device |
| JPS56126948A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Highly integrated semiconductor |
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1987
- 1987-09-21 JP JP1987143097U patent/JPS6448039U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5561041A (en) * | 1978-10-30 | 1980-05-08 | Mitsubishi Electric Corp | Packaging device for semiconductor integrated circuit |
| JPS55143045A (en) * | 1979-04-26 | 1980-11-08 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5651851A (en) * | 1979-10-05 | 1981-05-09 | Hitachi Ltd | Semiconductor device |
| JPS56126948A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Highly integrated semiconductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396047U (enExample) * | 1990-01-22 | 1991-10-01 | ||
| JPH06112359A (ja) * | 1992-09-30 | 1994-04-22 | Kyocera Corp | 電子部品搭載用回路基板 |