JPS6430834U - - Google Patents

Info

Publication number
JPS6430834U
JPS6430834U JP12679787U JP12679787U JPS6430834U JP S6430834 U JPS6430834 U JP S6430834U JP 12679787 U JP12679787 U JP 12679787U JP 12679787 U JP12679787 U JP 12679787U JP S6430834 U JPS6430834 U JP S6430834U
Authority
JP
Japan
Prior art keywords
wiring board
metal ball
lead
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12679787U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0625959Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12679787U priority Critical patent/JPH0625959Y2/ja
Publication of JPS6430834U publication Critical patent/JPS6430834U/ja
Application granted granted Critical
Publication of JPH0625959Y2 publication Critical patent/JPH0625959Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W90/754
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP12679787U 1987-08-19 1987-08-19 半導体装置 Expired - Lifetime JPH0625959Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12679787U JPH0625959Y2 (ja) 1987-08-19 1987-08-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12679787U JPH0625959Y2 (ja) 1987-08-19 1987-08-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6430834U true JPS6430834U (enExample) 1989-02-27
JPH0625959Y2 JPH0625959Y2 (ja) 1994-07-06

Family

ID=31378640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12679787U Expired - Lifetime JPH0625959Y2 (ja) 1987-08-19 1987-08-19 半導体装置

Country Status (1)

Country Link
JP (1) JPH0625959Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (ja) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Icモジユ−ルのワイヤボンデイング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (ja) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Icモジユ−ルのワイヤボンデイング方法

Also Published As

Publication number Publication date
JPH0625959Y2 (ja) 1994-07-06

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