JP2507271Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2507271Y2
JP2507271Y2 JP1990068702U JP6870290U JP2507271Y2 JP 2507271 Y2 JP2507271 Y2 JP 2507271Y2 JP 1990068702 U JP1990068702 U JP 1990068702U JP 6870290 U JP6870290 U JP 6870290U JP 2507271 Y2 JP2507271 Y2 JP 2507271Y2
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
semiconductor chip
lead frame
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990068702U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428452U (enExample
Inventor
利幸 駒水
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP1990068702U priority Critical patent/JP2507271Y2/ja
Publication of JPH0428452U publication Critical patent/JPH0428452U/ja
Application granted granted Critical
Publication of JP2507271Y2 publication Critical patent/JP2507271Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990068702U 1990-06-28 1990-06-28 半導体装置 Expired - Fee Related JP2507271Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990068702U JP2507271Y2 (ja) 1990-06-28 1990-06-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990068702U JP2507271Y2 (ja) 1990-06-28 1990-06-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH0428452U JPH0428452U (enExample) 1992-03-06
JP2507271Y2 true JP2507271Y2 (ja) 1996-08-14

Family

ID=31603365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990068702U Expired - Fee Related JP2507271Y2 (ja) 1990-06-28 1990-06-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2507271Y2 (enExample)

Also Published As

Publication number Publication date
JPH0428452U (enExample) 1992-03-06

Similar Documents

Publication Publication Date Title
JPH0546045U (ja) 半導体パツケージ
JPS629639A (ja) 半導体装置の製造方法
JPH06151641A (ja) 半導体装置
JP2507271Y2 (ja) 半導体装置
JPH0418694B2 (enExample)
JP4100483B2 (ja) 複合半導体装置及びその製造方法
JP3234614B2 (ja) 半導体装置及びその製造方法
US5484097A (en) Fabrication of hybrid semiconductor devices
JPH09129798A (ja) 電子部品およびその製法
JP2503646B2 (ja) リ―ドフレ―ムおよび半導体集積回路装置
JP2519651Y2 (ja) 樹脂封止型マルチチップパッケージのリードフレーム
JPH09172033A (ja) 半導体装置およびその製造方法
JPS589585B2 (ja) デンシブヒンヨウリ−ドフレ−ム
JPS6332269B2 (enExample)
JPH065756A (ja) 樹脂封止型半導体装置および製造方法
KR100621990B1 (ko) 반도체 패키지 및 그 제조 방법
JPS5847709Y2 (ja) 樹脂封止形半導体素子
JP3434633B2 (ja) 樹脂封止型半導体装置
JPH0423330Y2 (enExample)
JPS642445Y2 (enExample)
JPS59198744A (ja) 樹脂封止型半導体装置
JPH07101729B2 (ja) マルチチップ半導体装置およびその製造方法
JPH03152966A (ja) 半導体装置用リードフレーム
JPH02303056A (ja) 半導体集積回路の製造方法
JPH0547464Y2 (enExample)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees