JP2504586Y2 - 電子部品用パッケ―ジ - Google Patents

電子部品用パッケ―ジ

Info

Publication number
JP2504586Y2
JP2504586Y2 JP1989074671U JP7467189U JP2504586Y2 JP 2504586 Y2 JP2504586 Y2 JP 2504586Y2 JP 1989074671 U JP1989074671 U JP 1989074671U JP 7467189 U JP7467189 U JP 7467189U JP 2504586 Y2 JP2504586 Y2 JP 2504586Y2
Authority
JP
Japan
Prior art keywords
package
power supply
main body
electronic component
supply pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989074671U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313751U (cs
Inventor
正行 馬郡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1989074671U priority Critical patent/JP2504586Y2/ja
Publication of JPH0313751U publication Critical patent/JPH0313751U/ja
Application granted granted Critical
Publication of JP2504586Y2 publication Critical patent/JP2504586Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1989074671U 1989-06-26 1989-06-26 電子部品用パッケ―ジ Expired - Lifetime JP2504586Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989074671U JP2504586Y2 (ja) 1989-06-26 1989-06-26 電子部品用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989074671U JP2504586Y2 (ja) 1989-06-26 1989-06-26 電子部品用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0313751U JPH0313751U (cs) 1991-02-12
JP2504586Y2 true JP2504586Y2 (ja) 1996-07-10

Family

ID=31614566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989074671U Expired - Lifetime JP2504586Y2 (ja) 1989-06-26 1989-06-26 電子部品用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2504586Y2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584394B2 (ja) 1992-08-28 1997-02-26 日清製油株式会社 蛋白質分解物ペーストおよびそれを含有する食品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162848U (cs) * 1986-04-02 1987-10-16
JPH0186254U (cs) * 1987-11-28 1989-06-07
JPH02125355U (cs) * 1989-03-24 1990-10-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584394B2 (ja) 1992-08-28 1997-02-26 日清製油株式会社 蛋白質分解物ペーストおよびそれを含有する食品

Also Published As

Publication number Publication date
JPH0313751U (cs) 1991-02-12

Similar Documents

Publication Publication Date Title
US4982311A (en) Package for very large scale integrated circuit
US4941033A (en) Semiconductor integrated circuit device
JPH1174433A (ja) 半導体装置
JP2739954B2 (ja) 電力用半導体装置とその製造方法
JPH03108744A (ja) 樹脂封止型半導体装置
JPS5994441A (ja) 半導体装置の製造方法
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JP2504586Y2 (ja) 電子部品用パッケ―ジ
JPH06283639A (ja) 混成集積回路
JP2524482B2 (ja) Ｑｆｐ構造半導体装置
JPS6250063B2 (cs)
JP2879503B2 (ja) 面実装型電子回路装置
JPH03256351A (ja) 半導体装置
JPH079969B2 (ja) 高出力用混成集積回路装置
JP2771567B2 (ja) 混成集積回路
JPH10303537A (ja) パワー回路実装ユニット
JPH0458189B2 (cs)
JP2591999Y2 (ja) 集積回路のパッケージの構造
JPH0451488Y2 (cs)
JPH0817188B2 (ja) 半導体装置
JPH04216653A (ja) 半導体集積回路用パッケージおよびその実装方法
JPH0430565A (ja) 高出力用混成集積回路装置
JPH02141109A (ja) 圧電発振器の構造
JP2000124251A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPH06140535A (ja) テープキャリアパッケージ型半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term