JP2500236Y2 - フイルムキヤリアテ―プ - Google Patents
フイルムキヤリアテ―プInfo
- Publication number
- JP2500236Y2 JP2500236Y2 JP12441890U JP12441890U JP2500236Y2 JP 2500236 Y2 JP2500236 Y2 JP 2500236Y2 JP 12441890 U JP12441890 U JP 12441890U JP 12441890 U JP12441890 U JP 12441890U JP 2500236 Y2 JP2500236 Y2 JP 2500236Y2
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- film
- hole
- sprocket
- metal pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 9
- 239000000969 carrier Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12441890U JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12441890U JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0480048U JPH0480048U (en)van) | 1992-07-13 |
JP2500236Y2 true JP2500236Y2 (ja) | 1996-06-05 |
Family
ID=31872070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12441890U Expired - Lifetime JP2500236Y2 (ja) | 1990-11-26 | 1990-11-26 | フイルムキヤリアテ―プ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2500236Y2 (en)van) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6509630B1 (en) * | 1999-03-11 | 2003-01-21 | Seiko Epson Corporation | Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
-
1990
- 1990-11-26 JP JP12441890U patent/JP2500236Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0480048U (en)van) | 1992-07-13 |
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