JP2500236Y2 - Film carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the structure of a film carrier tape on which a semiconductor integrated circuit (hereinafter referred to as IC) chip is mounted.

[Conventional technology]

FIG. 6 is a plan view of a conventional film carrier tape (hereinafter, referred to as film carrier).
(1) is a film carrier, (2) is a resin film such as polyimide or polyester, (3) is a transport sprocket hole formed in the resin film (2), (4)
Is an outer lead hole formed in the resin film (2), and (5) is an inner lead hole formed in the resin film (2), where an IC chip (not shown) is arranged. (6) (7) is a conductor pattern in which a metal foil such as Cu stuck on the resin film (2) is formed by photolithography, and (6) is an inner lead connected to each electrode of the IC chip. , (7) are outer leads which become the external electrodes after resin sealing (not shown) including the inner lead connecting portion.

Next, the operation will be described. Film carrier is the sixth
A long tape is formed by continuously forming a plurality of parts shown in the figure, and the tape is reeled in and carried in. The long film carrier is carried by hooking the sprocket hole (3) of the film carrier (1) on the carrying sprocket of a manufacturing device (not shown). When it is necessary to connect film carriers to each other in the process of manufacturing ICs using this long film carrier, for example, the film carrier is damaged in the middle, or,
When I wanted to use a film carrier with a fractional length, it was very difficult to connect the sprocket holes (3) with good positional accuracy without breaking the example of equal distribution, and with satisfactory mechanical strength. . Simply stacking the film carriers and fixing them with adhesive tape would not be practically possible because the equidistant arrangement of the sprocket holes was disturbed and the film carriers did not pass through the path line of the carrier.

[Problems to be solved by the device]

Since the conventional film carrier is configured as described above, there is a problem that it is extremely difficult to connect the film carriers.

The present invention has been made in order to solve the above conventional problems, and an object thereof is to obtain a film carrier which can be connected with a predetermined mechanical strength without disturbing the equal arrangement of the sprocket holes. .

[Means for solving the problem]

The film carrier according to the present invention has a structure in which a resin pattern is sandwiched between the edge portion of the film carrier where the sprocket hole is formed and the adjacent IC component part and which has a metal pattern for conducting on the front and back surfaces. , This film carrier is inserted into the sprocket hole by overlaying it on a positioning jig that has positioning pins that fit in the sprocket hole with a small gap, and connecting the overlapping parts at multiple points by resistance spot welding. It is a thing.

[Action]

In the film carrier according to the present invention, the conductive pattern is formed on the front and back surfaces by sandwiching the resin film, which is an insulator, so that the conductive pattern on the surface of the first film carrier and the back surface of the second film carrier are overlapped. Since the conductor pattern is electrically conductive and is made of a metal material, it is possible to perform resistance spot welding in which thin metal plates are sandwiched by electrodes and a current is applied to perform welding. An equal arrangement of sprocket holes is obtained by stacking the film carrier to be connected on a positioning device having a positioning pin that fits in the sprocket hole of the film carrier and also functioning as an electrode and resistance spot welding. It is possible to obtain a mechanically strong connection with good positional accuracy without breaking the connection.

〔Example〕

Hereinafter, first to fifth embodiments of the present invention will be described with reference to FIGS. 1 to 5,
Since (2) to (7) are the same as those described in FIG. 6 of the related art, the description thereof will be omitted. (8) is Inley Lido (6)
And a metal pattern applied in the same manner as the outer lead (7) formation, (9) a through hole for conducting the metal patterns on both sides sandwiching the resin film (2), (10) a metal pattern (8), or This is a film carrier of the present invention having a metal pattern (8) and a through hole (9).

Next, the operation will be described. 1 to 5, when connecting the film carriers, a resistance spot welding machine (not shown) and a film carrier positioning jig also serving as an electrode of the welding machine are prepared. Fit the sprocket hole (3) of the film carrier (10) that you want to connect to the rectangular positioning pin of the positioning jig and stack the joints. At this time, it is advisable to hollow out the inside of the outer lead of one of the film carriers (10). In this state, an electrode different from the positioning jig of the resistance spot welder is pressed onto the metal pattern (8) of the film carrier (10) on the upper side, so that the pressed electrode to the film carrier (10) on the upper side of the stacking. ) Metal pattern (8) and through hole (9) to the lower film carrier (1)
A current flows through the metal pattern (8) and the through hole (9) of (0) to the electrode that also serves as a positioning jig to perform spot welding.

The spot welding is performed several times to connect the overlapping portions.

Here, in the film carrier of FIG. 1 showing the first embodiment, a resin film is sandwiched between the edge portion where the sprocket hole is formed and the adjacent IC component portion for conduction (through the through hole (9)). This is a strip-shaped conductive metal pattern formed on both sides.

FIG. 2 showing the embodiment of FIG. 2 is, for the film carrier shown in FIG. 1, formed a strip-shaped metal pattern on both sides of the edge portion where the sprocket hole is formed, and conducts through the through hole. It was done like this.

FIG. 3 showing a third embodiment is the film carrier of FIG. 2 in which the metal pattern is not formed in a strip shape but is intermittently formed between the sprocket holes.

The film carrier shown in FIG. 4 showing the fourth embodiment is different from the film carrier shown in FIG. 1 in that the metal pattern between the adjacent IC component parts is intermittently formed from a strip shape. In the film carriers shown in FIG. 4, the metal patterns on the front and back surfaces are electrically connected by the through holes.

The film carrier shown in FIG. 5 showing the embodiment shown in FIG. 5 is different from the film carrier shown in FIG. 2 in that a metal pattern is formed so as to cover the corners of the resin film, not the front and back conduction by through holes.

[Effect of device]

As described above, according to the present invention, a structure having a metal pattern that is conductive between the front and back sides of a resin film between the edge of the film carrier in which the sprocket hole is formed and the adjacent IC component Therefore, it is possible to use resistance spot welding together with the positioning jig, and it is possible to connect the film carrier with mechanical strength without disturbing the equal arrangement of the sprocket holes, and the film carrier that was a problem in the past. There is an effect that the damage can be repaired and a film carrier tape having a fractional length can be used.

Further, since the sprocket hole portion is connected to the reinforcement, there is an effect that the transportation in the manufacturing apparatus becomes stable.

[Brief description of drawings]

1 is a plan view showing a film carrier according to a first embodiment of the present invention, FIG. 2 is a plan view showing a film carrier according to a second embodiment of the present invention, and FIG. 3 is a third view of the present invention. FIG. 5 is a plan view showing a film carrier according to an embodiment, FIG. 4 is a plan view showing a film carrier according to a fourth embodiment of the present invention, and FIG. 5 (a) is a film carrier according to the fifth embodiment of the present invention. A plan view, FIG. 5 (b) is a side view, and FIG. 6 is a plan view showing the structure of a conventional film carrier. In the figure, (2) is a resin film,
(3) Sprocket hole, (4) Outer lead hole, (5) Inner lead hole, (6) Inner lead, (7) Outer lead, (8) Metal pattern, (9) Through Hall, (10) is the film carrier. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

(57) [Scope of utility model registration request] 1. A film carrier tape having a semiconductor chip having a metal wiring pattern formed on the surface of a resin film having holes such as sprocket holes, and the like, at the edge of the film carrier where the sprocket holes are formed. A film carrier tape, which is characterized in that a metal pattern, which is electrically conductive on both sides, is provided between resin films, either continuously or intermittently.