JP2025536163A5 - - Google Patents

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Publication number
JP2025536163A5
JP2025536163A5 JP2023552547A JP2023552547A JP2025536163A5 JP 2025536163 A5 JP2025536163 A5 JP 2025536163A5 JP 2023552547 A JP2023552547 A JP 2023552547A JP 2023552547 A JP2023552547 A JP 2023552547A JP 2025536163 A5 JP2025536163 A5 JP 2025536163A5
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JP
Japan
Prior art keywords
electrode
semiconductor layer
substrate
contact region
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023552547A
Other languages
English (en)
Japanese (ja)
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JP2025536163A (ja
Filing date
Publication date
Priority claimed from CN202211269945.4A external-priority patent/CN115346987B/zh
Application filed filed Critical
Publication of JP2025536163A publication Critical patent/JP2025536163A/ja
Publication of JP2025536163A5 publication Critical patent/JP2025536163A5/ja
Pending legal-status Critical Current

Links

JP2023552547A 2022-10-18 2022-12-07 記憶ユニット、3dメモリ及びその製造方法、電子装置 Pending JP2025536163A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202211269945.4 2022-10-18
CN202211269945.4A CN115346987B (zh) 2022-10-18 2022-10-18 一种存储单元、3d存储器及其制备方法、电子设备
PCT/CN2022/137319 WO2024082394A1 (zh) 2022-10-18 2022-12-07 存储单元、3d存储器及其制备方法、电子设备

Publications (2)

Publication Number Publication Date
JP2025536163A JP2025536163A (ja) 2025-11-05
JP2025536163A5 true JP2025536163A5 (https=) 2025-12-08

Family

ID=88836636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552547A Pending JP2025536163A (ja) 2022-10-18 2022-12-07 記憶ユニット、3dメモリ及びその製造方法、電子装置

Country Status (4)

Country Link
US (1) US11825642B1 (https=)
EP (1) EP4380330A4 (https=)
JP (1) JP2025536163A (https=)
KR (1) KR20250088678A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102792830B1 (ko) * 2023-10-04 2025-04-07 한양대학교 산학협력단 올 어라운드 채널을 갖는 트랜지스터 수직 적층 구조 기반 4f2용 dram 소자 및 이의 제조방법
CN117979690B (zh) * 2023-12-22 2024-09-27 北京超弦存储器研究院 一种半导体器件及其制造方法、电子设备
US12592275B2 (en) * 2024-01-09 2026-03-31 Macronix International Co., Ltd. Memory structure and control method for reducing layout area of memory device
KR102903487B1 (ko) * 2024-09-27 2025-12-23 건국대학교 산학협력단 커패시터리스 디램 셀 및 그 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7742328B2 (en) 2007-06-15 2010-06-22 Grandis, Inc. Method and system for providing spin transfer tunneling magnetic memories utilizing non-planar transistors
US11329051B2 (en) 2020-08-28 2022-05-10 Micron Technology, Inc. Gate dielectric repair on three-node access device formation for vertical three-dimensional (3D) memory
WO2022188010A1 (zh) * 2021-03-08 2022-09-15 华为技术有限公司 半导体装置、电子设备、晶体管的形成方法
CN114334980B (zh) 2021-11-17 2026-03-20 中国科学院微电子研究所 一种基于薄膜晶体管的无电容dram单元结构及制造方法
CN114446963B (zh) 2021-12-01 2025-06-06 北京超弦存储器研究院 半导体存储单元结构、半导体存储器及其制备方法、应用
CN114864583A (zh) 2022-05-12 2022-08-05 中国科学院微电子研究所 一种无电容dram单元结构及制造方法
CN115020480A (zh) * 2022-05-31 2022-09-06 长鑫存储技术有限公司 半导体结构
CN115346987B (zh) 2022-10-18 2023-01-10 北京超弦存储器研究院 一种存储单元、3d存储器及其制备方法、电子设备

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