JP2025534922A5 - - Google Patents

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Publication number
JP2025534922A5
JP2025534922A5 JP2023548807A JP2023548807A JP2025534922A5 JP 2025534922 A5 JP2025534922 A5 JP 2025534922A5 JP 2023548807 A JP2023548807 A JP 2023548807A JP 2023548807 A JP2023548807 A JP 2023548807A JP 2025534922 A5 JP2025534922 A5 JP 2025534922A5
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JP
Japan
Prior art keywords
electrode
substrate
semiconductor layer
drain
source
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Pending
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JP2023548807A
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English (en)
Japanese (ja)
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JP2025534922A (ja
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Priority claimed from CN202211270027.3A external-priority patent/CN115346988B/zh
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Publication of JP2025534922A publication Critical patent/JP2025534922A/ja
Publication of JP2025534922A5 publication Critical patent/JP2025534922A5/ja
Pending legal-status Critical Current

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JP2023548807A 2022-10-18 2022-12-07 トランジスタ、3dメモリ及びその製造方法、電子装置 Pending JP2025534922A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202211270027.3 2022-10-18
CN202211270027.3A CN115346988B (zh) 2022-10-18 2022-10-18 一种晶体管、3d存储器及其制备方法、电子设备
PCT/CN2022/137325 WO2024082395A1 (zh) 2022-10-18 2022-12-07 晶体管、3d存储器及其制造方法、电子设备

Publications (2)

Publication Number Publication Date
JP2025534922A JP2025534922A (ja) 2025-10-22
JP2025534922A5 true JP2025534922A5 (https=) 2025-12-12

Family

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Family Applications (1)

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JP2023548807A Pending JP2025534922A (ja) 2022-10-18 2022-12-07 トランジスタ、3dメモリ及びその製造方法、電子装置

Country Status (4)

Country Link
US (1) US12328863B2 (https=)
EP (1) EP4380329A4 (https=)
JP (1) JP2025534922A (https=)
KR (1) KR20250093445A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115996570B (zh) * 2023-03-24 2023-06-16 北京超弦存储器研究院 存储器、存储器的制作方法及电子设备
US20250185331A1 (en) * 2023-12-04 2025-06-05 International Business Machines Corporation Stacked transistor backside contact formation

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KR100574317B1 (ko) 2004-02-19 2006-04-26 삼성전자주식회사 게이트 구조물, 이를 갖는 반도체 장치 및 그 형성 방법
US7742328B2 (en) 2007-06-15 2010-06-22 Grandis, Inc. Method and system for providing spin transfer tunneling magnetic memories utilizing non-planar transistors
WO2019005651A1 (en) * 2017-06-29 2019-01-03 Micron Technology, Inc. MEMORY BARRETTES COMPRISING VERTICALLY ALTERNATE STAGES OF INSULATING MATERIAL AND MEMORY CELLS, AND METHODS OF MEMORY BAR FORMATION COMPRISING MEMORY CELLS INDIVIDUALLY COMPRISING A TRANSISTOR AND A CAPACITOR
CN109309122B (zh) * 2018-09-17 2022-02-01 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置
KR102674883B1 (ko) * 2018-12-21 2024-06-14 에스케이하이닉스 주식회사 적층된 셀 트랜지스터들을 포함하는 비휘발성 메모리 소자 및 상기 비휘발성 메모리 소자의 동작 방법
KR102847704B1 (ko) 2019-10-08 2025-08-21 삼성전자주식회사 반도체 메모리 소자 및 그의 제조 방법
US11374057B2 (en) * 2020-06-23 2022-06-28 Taiwan Semiconductor Manufacturing Company Limited Vertical metal oxide semiconductor channel selector transistor and methods of forming the same
US11329051B2 (en) 2020-08-28 2022-05-10 Micron Technology, Inc. Gate dielectric repair on three-node access device formation for vertical three-dimensional (3D) memory
KR20220050615A (ko) * 2020-10-16 2022-04-25 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
CN114334980B (zh) 2021-11-17 2026-03-20 中国科学院微电子研究所 一种基于薄膜晶体管的无电容dram单元结构及制造方法
CN114446963B (zh) 2021-12-01 2025-06-06 北京超弦存储器研究院 半导体存储单元结构、半导体存储器及其制备方法、应用
CN114023744B (zh) * 2022-01-10 2022-03-25 长鑫存储技术有限公司 一种半导体结构、半导体结构的制备方法和半导体存储器
CN114709211B (zh) 2022-04-02 2022-11-15 北京超弦存储器研究院 动态存储器及其制作、读写方法、电子设备、存储电路
CN114864583A (zh) 2022-05-12 2022-08-05 中国科学院微电子研究所 一种无电容dram单元结构及制造方法
CN115020480A (zh) * 2022-05-31 2022-09-06 长鑫存储技术有限公司 半导体结构
CN115346987B (zh) 2022-10-18 2023-01-10 北京超弦存储器研究院 一种存储单元、3d存储器及其制备方法、电子设备
CN115346988B (zh) 2022-10-18 2023-01-24 北京超弦存储器研究院 一种晶体管、3d存储器及其制备方法、电子设备

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