JP2025512235A5 - - Google Patents

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Publication number
JP2025512235A5
JP2025512235A5 JP2024549153A JP2024549153A JP2025512235A5 JP 2025512235 A5 JP2025512235 A5 JP 2025512235A5 JP 2024549153 A JP2024549153 A JP 2024549153A JP 2024549153 A JP2024549153 A JP 2024549153A JP 2025512235 A5 JP2025512235 A5 JP 2025512235A5
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JP
Japan
Prior art keywords
metal
substrate
smi
lmi
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025512235A (ja
Filing date
Publication date
Priority claimed from US18/156,142 external-priority patent/US12588435B2/en
Application filed filed Critical
Publication of JP2025512235A publication Critical patent/JP2025512235A/ja
Publication of JP2025512235A5 publication Critical patent/JP2025512235A5/ja
Pending legal-status Critical Current

Links

JP2024549153A 2022-02-28 2023-02-27 選択的金属堆積のための選択的阻害 Pending JP2025512235A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202263315062P 2022-02-28 2022-02-28
US63/315,062 2022-02-28
US18/156,142 2023-01-18
US18/156,142 US12588435B2 (en) 2022-02-28 2023-01-18 Selective inhibition for selective metal deposition
PCT/US2023/063327 WO2023164685A1 (en) 2022-02-28 2023-02-27 Selective inhibition for selective metal deposition

Publications (2)

Publication Number Publication Date
JP2025512235A JP2025512235A (ja) 2025-04-17
JP2025512235A5 true JP2025512235A5 (https=) 2026-01-21

Family

ID=87761179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549153A Pending JP2025512235A (ja) 2022-02-28 2023-02-27 選択的金属堆積のための選択的阻害

Country Status (5)

Country Link
US (1) US12588435B2 (https=)
JP (1) JP2025512235A (https=)
KR (1) KR20240157662A (https=)
TW (1) TW202348825A (https=)
WO (1) WO2023164685A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240431025A1 (en) * 2023-06-26 2024-12-26 International Business Machines Corporation Corrosion resistant single damascene interconnects
WO2025217071A1 (en) * 2024-04-08 2025-10-16 Lam Research Corporation Isonitrile inhibitors in ald

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8242019B2 (en) 2009-03-31 2012-08-14 Tokyo Electron Limited Selective deposition of metal-containing cap layers for semiconductor devices
SG11202009105YA (en) 2018-03-20 2020-10-29 Tokyo Electron Ltd Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
KR102800886B1 (ko) 2018-08-23 2025-04-29 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 방법
JP2020056104A (ja) 2018-10-02 2020-04-09 エーエスエム アイピー ホールディング ビー.ブイ. 選択的パッシベーションおよび選択的堆積
CN112805818B (zh) * 2018-10-10 2024-10-18 东京毅力科创株式会社 用低电阻率金属填充半导体器件中的凹陷特征的方法
US11282745B2 (en) 2019-04-28 2022-03-22 Applied Materials, Inc. Methods for filling features with ruthenium
US20200347493A1 (en) 2019-05-05 2020-11-05 Applied Materials, Inc. Reverse Selective Deposition
US11286556B2 (en) 2020-04-14 2022-03-29 Applied Materials, Inc. Selective deposition of titanium films
WO2021262527A1 (en) 2020-06-23 2021-12-30 Lam Research Corporation Selective deposition using graphene as an inhibitor
US11094543B1 (en) 2020-12-04 2021-08-17 Tokyo Electron Limited Defect correction on metal resists

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