JP2025512235A5 - - Google Patents
Info
- Publication number
- JP2025512235A5 JP2025512235A5 JP2024549153A JP2024549153A JP2025512235A5 JP 2025512235 A5 JP2025512235 A5 JP 2025512235A5 JP 2024549153 A JP2024549153 A JP 2024549153A JP 2024549153 A JP2024549153 A JP 2024549153A JP 2025512235 A5 JP2025512235 A5 JP 2025512235A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- smi
- lmi
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263315062P | 2022-02-28 | 2022-02-28 | |
| US63/315,062 | 2022-02-28 | ||
| US18/156,142 | 2023-01-18 | ||
| US18/156,142 US12588435B2 (en) | 2022-02-28 | 2023-01-18 | Selective inhibition for selective metal deposition |
| PCT/US2023/063327 WO2023164685A1 (en) | 2022-02-28 | 2023-02-27 | Selective inhibition for selective metal deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025512235A JP2025512235A (ja) | 2025-04-17 |
| JP2025512235A5 true JP2025512235A5 (enExample) | 2026-01-21 |
Family
ID=87761179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549153A Pending JP2025512235A (ja) | 2022-02-28 | 2023-02-27 | 選択的金属堆積のための選択的阻害 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12588435B2 (enExample) |
| JP (1) | JP2025512235A (enExample) |
| KR (1) | KR20240157662A (enExample) |
| TW (1) | TW202348825A (enExample) |
| WO (1) | WO2023164685A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240431025A1 (en) * | 2023-06-26 | 2024-12-26 | International Business Machines Corporation | Corrosion resistant single damascene interconnects |
| WO2025217071A1 (en) * | 2024-04-08 | 2025-10-16 | Lam Research Corporation | Isonitrile inhibitors in ald |
| CN118291951B (zh) * | 2024-04-08 | 2025-02-25 | 合肥安德科铭半导体科技有限公司 | 一种有机小分子抑制剂及其在薄膜沉积中的应用方法 |
| CN121865857A (zh) * | 2026-03-13 | 2026-04-14 | 上海稷以科技有限公司 | 一种间隙特征的填充方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8242019B2 (en) | 2009-03-31 | 2012-08-14 | Tokyo Electron Limited | Selective deposition of metal-containing cap layers for semiconductor devices |
| KR102711644B1 (ko) | 2018-03-20 | 2024-09-27 | 도쿄엘렉트론가부시키가이샤 | 통합형 반도체 공정 모듈을 포함하는 자기 인식 및 보정 이종 플랫폼, 및 이를 사용하기 위한 방법 |
| KR102800886B1 (ko) | 2018-08-23 | 2025-04-29 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 방법 |
| JP2020056104A (ja) | 2018-10-02 | 2020-04-09 | エーエスエム アイピー ホールディング ビー．ブイ． | 選択的パッシベーションおよび選択的堆積 |
| KR102759932B1 (ko) * | 2018-10-10 | 2025-01-23 | 도쿄엘렉트론가부시키가이샤 | 반도체 소자의 함입형 형상부를 저-저항률 금속으로 충전하기 위한 방법 |
| US11282745B2 (en) | 2019-04-28 | 2022-03-22 | Applied Materials, Inc. | Methods for filling features with ruthenium |
| US20200347493A1 (en) | 2019-05-05 | 2020-11-05 | Applied Materials, Inc. | Reverse Selective Deposition |
| US11286556B2 (en) | 2020-04-14 | 2022-03-29 | Applied Materials, Inc. | Selective deposition of titanium films |
| US20230245924A1 (en) | 2020-06-23 | 2023-08-03 | Lam Research Corporation | Selective deposition using graphene as an inhibitor |
| US11094543B1 (en) | 2020-12-04 | 2021-08-17 | Tokyo Electron Limited | Defect correction on metal resists |
-
2023
- 2023-01-18 US US18/156,142 patent/US12588435B2/en active Active
- 2023-02-27 KR KR1020247028048A patent/KR20240157662A/ko active Pending
- 2023-02-27 JP JP2024549153A patent/JP2025512235A/ja active Pending
- 2023-02-27 WO PCT/US2023/063327 patent/WO2023164685A1/en not_active Ceased
- 2023-03-01 TW TW112107265A patent/TW202348825A/zh unknown
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