JP2025503298A5 - - Google Patents
Info
- Publication number
- JP2025503298A5 JP2025503298A5 JP2024545255A JP2024545255A JP2025503298A5 JP 2025503298 A5 JP2025503298 A5 JP 2025503298A5 JP 2024545255 A JP2024545255 A JP 2024545255A JP 2024545255 A JP2024545255 A JP 2024545255A JP 2025503298 A5 JP2025503298 A5 JP 2025503298A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrical contact
- holder according
- substrate holder
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP22154314.3 | 2022-01-31 | ||
| EP22154314.3A EP4219800A1 (en) | 2022-01-31 | 2022-01-31 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
| PCT/EP2022/087732 WO2023143842A1 (en) | 2022-01-31 | 2022-12-23 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025503298A JP2025503298A (ja) | 2025-01-30 |
| JP2025503298A5 true JP2025503298A5 (https=) | 2025-12-25 |
Family
ID=80218702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545255A Pending JP2025503298A (ja) | 2022-01-31 | 2022-12-23 | 基板の化学及び／又は電解表面処理において前記基板を保持する基板ホルダ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250137161A1 (https=) |
| EP (1) | EP4219800A1 (https=) |
| JP (1) | JP2025503298A (https=) |
| KR (1) | KR20240144285A (https=) |
| CN (1) | CN118660992A (https=) |
| TW (1) | TW202334515A (https=) |
| WO (1) | WO2023143842A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060289302A1 (en) * | 2005-06-28 | 2006-12-28 | Semitool, Inc. | Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces |
| US10066311B2 (en) * | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP6747859B2 (ja) * | 2016-05-09 | 2020-08-26 | 株式会社荏原製作所 | 基板ホルダ及びこれを用いためっき装置 |
-
2022
- 2022-01-31 EP EP22154314.3A patent/EP4219800A1/en active Pending
- 2022-12-23 KR KR1020247028971A patent/KR20240144285A/ko active Pending
- 2022-12-23 WO PCT/EP2022/087732 patent/WO2023143842A1/en not_active Ceased
- 2022-12-23 JP JP2024545255A patent/JP2025503298A/ja active Pending
- 2022-12-23 CN CN202280090561.8A patent/CN118660992A/zh active Pending
- 2022-12-23 US US18/834,576 patent/US20250137161A1/en active Pending
-
2023
- 2023-01-31 TW TW112103243A patent/TW202334515A/zh unknown
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