TW202334515A - 用於在基板之化學及/或電解表面處理中固定基板的基板支架 - Google Patents
用於在基板之化學及/或電解表面處理中固定基板的基板支架 Download PDFInfo
- Publication number
- TW202334515A TW202334515A TW112103243A TW112103243A TW202334515A TW 202334515 A TW202334515 A TW 202334515A TW 112103243 A TW112103243 A TW 112103243A TW 112103243 A TW112103243 A TW 112103243A TW 202334515 A TW202334515 A TW 202334515A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- unit
- carrier
- electrical contact
- substrate carrier
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 313
- 238000004381 surface treatment Methods 0.000 title claims abstract description 27
- 239000000126 substance Substances 0.000 title claims abstract description 15
- 238000007654 immersion Methods 0.000 claims abstract description 41
- 238000003756 stirring Methods 0.000 claims description 8
- 230000002146 bilateral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 18
- 238000009826 distribution Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP22154314.3 | 2022-01-31 | ||
| EP22154314.3A EP4219800A1 (en) | 2022-01-31 | 2022-01-31 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
| WOPCT/EP2022/087732 | 2022-12-23 | ||
| PCT/EP2022/087732 WO2023143842A1 (en) | 2022-01-31 | 2022-12-23 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202334515A true TW202334515A (zh) | 2023-09-01 |
Family
ID=80218702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112103243A TW202334515A (zh) | 2022-01-31 | 2023-01-31 | 用於在基板之化學及/或電解表面處理中固定基板的基板支架 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250137161A1 (https=) |
| EP (1) | EP4219800A1 (https=) |
| JP (1) | JP2025503298A (https=) |
| KR (1) | KR20240144285A (https=) |
| CN (1) | CN118660992A (https=) |
| TW (1) | TW202334515A (https=) |
| WO (1) | WO2023143842A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060289302A1 (en) * | 2005-06-28 | 2006-12-28 | Semitool, Inc. | Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces |
| US10066311B2 (en) * | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP6747859B2 (ja) * | 2016-05-09 | 2020-08-26 | 株式会社荏原製作所 | 基板ホルダ及びこれを用いためっき装置 |
-
2022
- 2022-01-31 EP EP22154314.3A patent/EP4219800A1/en active Pending
- 2022-12-23 KR KR1020247028971A patent/KR20240144285A/ko active Pending
- 2022-12-23 WO PCT/EP2022/087732 patent/WO2023143842A1/en not_active Ceased
- 2022-12-23 JP JP2024545255A patent/JP2025503298A/ja active Pending
- 2022-12-23 CN CN202280090561.8A patent/CN118660992A/zh active Pending
- 2022-12-23 US US18/834,576 patent/US20250137161A1/en active Pending
-
2023
- 2023-01-31 TW TW112103243A patent/TW202334515A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20250137161A1 (en) | 2025-05-01 |
| KR20240144285A (ko) | 2024-10-02 |
| EP4219800A1 (en) | 2023-08-02 |
| CN118660992A (zh) | 2024-09-17 |
| WO2023143842A1 (en) | 2023-08-03 |
| JP2025503298A (ja) | 2025-01-30 |
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