JP2025503298A - 基板の化学及び／又は電解表面処理において前記基板を保持する基板ホルダ - Google Patents

基板の化学及び／又は電解表面処理において前記基板を保持する基板ホルダ Download PDF

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Publication number
JP2025503298A
JP2025503298A JP2024545255A JP2024545255A JP2025503298A JP 2025503298 A JP2025503298 A JP 2025503298A JP 2024545255 A JP2024545255 A JP 2024545255A JP 2024545255 A JP2024545255 A JP 2024545255A JP 2025503298 A JP2025503298 A JP 2025503298A
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JP
Japan
Prior art keywords
substrate
electrical contact
substrate holder
unit
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024545255A
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English (en)
Japanese (ja)
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JP2025503298A5 (https=
Inventor
グライスナー アンドレアス
ホファー ゲオルグ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semsysco GmbH
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Semsysco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semsysco GmbH filed Critical Semsysco GmbH
Publication of JP2025503298A publication Critical patent/JP2025503298A/ja
Publication of JP2025503298A5 publication Critical patent/JP2025503298A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2024545255A 2022-01-31 2022-12-23 基板の化学及び／又は電解表面処理において前記基板を保持する基板ホルダ Pending JP2025503298A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP22154314.3 2022-01-31
EP22154314.3A EP4219800A1 (en) 2022-01-31 2022-01-31 Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate
PCT/EP2022/087732 WO2023143842A1 (en) 2022-01-31 2022-12-23 Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate

Publications (2)

Publication Number Publication Date
JP2025503298A true JP2025503298A (ja) 2025-01-30
JP2025503298A5 JP2025503298A5 (https=) 2025-12-25

Family

ID=80218702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024545255A Pending JP2025503298A (ja) 2022-01-31 2022-12-23 基板の化学及び／又は電解表面処理において前記基板を保持する基板ホルダ

Country Status (7)

Country Link
US (1) US20250137161A1 (https=)
EP (1) EP4219800A1 (https=)
JP (1) JP2025503298A (https=)
KR (1) KR20240144285A (https=)
CN (1) CN118660992A (https=)
TW (1) TW202334515A (https=)
WO (1) WO2023143842A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060289302A1 (en) * 2005-06-28 2006-12-28 Semitool, Inc. Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces
US10066311B2 (en) * 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
JP5782398B2 (ja) * 2012-03-27 2015-09-24 株式会社荏原製作所 めっき方法及びめっき装置
JP6747859B2 (ja) * 2016-05-09 2020-08-26 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置

Also Published As

Publication number Publication date
US20250137161A1 (en) 2025-05-01
TW202334515A (zh) 2023-09-01
KR20240144285A (ko) 2024-10-02
EP4219800A1 (en) 2023-08-02
CN118660992A (zh) 2024-09-17
WO2023143842A1 (en) 2023-08-03

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