CN118660992A - 用于在对基底进行化学和/或电解表面处理时固持基底的基底支架 - Google Patents

用于在对基底进行化学和/或电解表面处理时固持基底的基底支架 Download PDF

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Publication number
CN118660992A
CN118660992A CN202280090561.8A CN202280090561A CN118660992A CN 118660992 A CN118660992 A CN 118660992A CN 202280090561 A CN202280090561 A CN 202280090561A CN 118660992 A CN118660992 A CN 118660992A
Authority
CN
China
Prior art keywords
substrate
unit
carrier
power contact
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280090561.8A
Other languages
English (en)
Chinese (zh)
Inventor
安德烈亚斯·格莱斯纳
乔戈·豪佛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semisco Co ltd
Original Assignee
Semisco Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semisco Co ltd filed Critical Semisco Co ltd
Publication of CN118660992A publication Critical patent/CN118660992A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280090561.8A 2022-01-31 2022-12-23 用于在对基底进行化学和/或电解表面处理时固持基底的基底支架 Pending CN118660992A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP22154314.3 2022-01-31
EP22154314.3A EP4219800A1 (en) 2022-01-31 2022-01-31 Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate
PCT/EP2022/087732 WO2023143842A1 (en) 2022-01-31 2022-12-23 Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate

Publications (1)

Publication Number Publication Date
CN118660992A true CN118660992A (zh) 2024-09-17

Family

ID=80218702

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280090561.8A Pending CN118660992A (zh) 2022-01-31 2022-12-23 用于在对基底进行化学和/或电解表面处理时固持基底的基底支架

Country Status (7)

Country Link
US (1) US20250137161A1 (https=)
EP (1) EP4219800A1 (https=)
JP (1) JP2025503298A (https=)
KR (1) KR20240144285A (https=)
CN (1) CN118660992A (https=)
TW (1) TW202334515A (https=)
WO (1) WO2023143842A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060289302A1 (en) * 2005-06-28 2006-12-28 Semitool, Inc. Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces
US10066311B2 (en) * 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
JP5782398B2 (ja) * 2012-03-27 2015-09-24 株式会社荏原製作所 めっき方法及びめっき装置
JP6747859B2 (ja) * 2016-05-09 2020-08-26 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置

Also Published As

Publication number Publication date
US20250137161A1 (en) 2025-05-01
TW202334515A (zh) 2023-09-01
KR20240144285A (ko) 2024-10-02
EP4219800A1 (en) 2023-08-02
WO2023143842A1 (en) 2023-08-03
JP2025503298A (ja) 2025-01-30

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PB01 Publication
SE01 Entry into force of request for substantive examination
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CB02 Change of applicant information

Country or region after: Austria

Address after: Salzburg, Austria

Applicant after: Panlin Group Salzburg Ltd.

Address before: Salzburg, Austria

Applicant before: Semisco Co.,Ltd.

Country or region before: Austria