KR20240144285A - 기판의 화학적 및/또는 전해 표면 처리에서 기판을 고정하는 기판 홀더 - Google Patents
기판의 화학적 및/또는 전해 표면 처리에서 기판을 고정하는 기판 홀더 Download PDFInfo
- Publication number
- KR20240144285A KR20240144285A KR1020247028971A KR20247028971A KR20240144285A KR 20240144285 A KR20240144285 A KR 20240144285A KR 1020247028971 A KR1020247028971 A KR 1020247028971A KR 20247028971 A KR20247028971 A KR 20247028971A KR 20240144285 A KR20240144285 A KR 20240144285A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- substrate holder
- holder
- carrier
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP22154314.3 | 2022-01-31 | ||
| EP22154314.3A EP4219800A1 (en) | 2022-01-31 | 2022-01-31 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
| PCT/EP2022/087732 WO2023143842A1 (en) | 2022-01-31 | 2022-12-23 | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240144285A true KR20240144285A (ko) | 2024-10-02 |
Family
ID=80218702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247028971A Pending KR20240144285A (ko) | 2022-01-31 | 2022-12-23 | 기판의 화학적 및/또는 전해 표면 처리에서 기판을 고정하는 기판 홀더 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250137161A1 (https=) |
| EP (1) | EP4219800A1 (https=) |
| JP (1) | JP2025503298A (https=) |
| KR (1) | KR20240144285A (https=) |
| CN (1) | CN118660992A (https=) |
| TW (1) | TW202334515A (https=) |
| WO (1) | WO2023143842A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060289302A1 (en) * | 2005-06-28 | 2006-12-28 | Semitool, Inc. | Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces |
| US10066311B2 (en) * | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP6747859B2 (ja) * | 2016-05-09 | 2020-08-26 | 株式会社荏原製作所 | 基板ホルダ及びこれを用いためっき装置 |
-
2022
- 2022-01-31 EP EP22154314.3A patent/EP4219800A1/en active Pending
- 2022-12-23 KR KR1020247028971A patent/KR20240144285A/ko active Pending
- 2022-12-23 WO PCT/EP2022/087732 patent/WO2023143842A1/en not_active Ceased
- 2022-12-23 JP JP2024545255A patent/JP2025503298A/ja active Pending
- 2022-12-23 CN CN202280090561.8A patent/CN118660992A/zh active Pending
- 2022-12-23 US US18/834,576 patent/US20250137161A1/en active Pending
-
2023
- 2023-01-31 TW TW112103243A patent/TW202334515A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20250137161A1 (en) | 2025-05-01 |
| TW202334515A (zh) | 2023-09-01 |
| EP4219800A1 (en) | 2023-08-02 |
| CN118660992A (zh) | 2024-09-17 |
| WO2023143842A1 (en) | 2023-08-03 |
| JP2025503298A (ja) | 2025-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |