JP2025502980A5 - - Google Patents
Info
- Publication number
- JP2025502980A5 JP2025502980A5 JP2024542242A JP2024542242A JP2025502980A5 JP 2025502980 A5 JP2025502980 A5 JP 2025502980A5 JP 2024542242 A JP2024542242 A JP 2024542242A JP 2024542242 A JP2024542242 A JP 2024542242A JP 2025502980 A5 JP2025502980 A5 JP 2025502980A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat spreader
- cooling plate
- solder
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263301003P | 2022-01-19 | 2022-01-19 | |
| US63/301,003 | 2022-01-19 | ||
| PCT/US2023/010702 WO2023141052A1 (en) | 2022-01-19 | 2023-01-12 | A method for applying a cooling solution to one or more integrated circuit components and assemble for integrated circuit cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025502980A JP2025502980A (ja) | 2025-01-30 |
| JP2025502980A5 true JP2025502980A5 (https=) | 2025-11-13 |
Family
ID=85199433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024542242A Pending JP2025502980A (ja) | 2022-01-19 | 2023-01-12 | 集積回路の冷却のための効率的な熱拡散方法及びアセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250105085A1 (https=) |
| EP (1) | EP4466734A1 (https=) |
| JP (1) | JP2025502980A (https=) |
| KR (1) | KR20240137605A (https=) |
| CN (1) | CN118749132A (https=) |
| TW (1) | TW202341371A (https=) |
| WO (1) | WO2023141052A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250069978A1 (en) * | 2023-08-23 | 2025-02-27 | SK Hynix NAND Product Solutions Corp. (dba Solidigm) | Thermal spreader |
| US20250112110A1 (en) * | 2023-10-02 | 2025-04-03 | Stmicroelectronics International N.V. | Thermally enhanced flip chip ball grid array package with improved heat dissipation |
| DE102023129490A1 (de) * | 2023-10-25 | 2025-04-30 | TRUMPF Hüttinger GmbH + Co. KG | Hochfrequenzverstärkeranordnung |
| US20250246501A1 (en) * | 2024-01-25 | 2025-07-31 | Apple Inc. | Integrated circuit assembly with die coupled to lid |
| CN118673865B (zh) * | 2024-08-02 | 2025-06-17 | 深圳陕煤高新技术研究院有限公司 | 双面散热封装器件参数确定方法、系统、设备及存储介质 |
| TWI906171B (zh) * | 2025-04-08 | 2025-11-21 | 技嘉科技股份有限公司 | 電子裝置及防護組件 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09306954A (ja) * | 1996-05-20 | 1997-11-28 | Hitachi Ltd | 半導体装置及びその実装方法並びに実装構造体 |
| US6504242B1 (en) * | 2001-11-15 | 2003-01-07 | Intel Corporation | Electronic assembly having a wetting layer on a thermally conductive heat spreader |
| US20050121776A1 (en) * | 2003-12-05 | 2005-06-09 | Deppisch Carl L. | Integrated solder and heat spreader fabrication |
| US20080157345A1 (en) * | 2006-12-29 | 2008-07-03 | Daoqiang Lu | Curved heat spreader design for electronic assemblies |
| US9064971B2 (en) * | 2012-12-20 | 2015-06-23 | Intel Corporation | Methods of forming ultra thin package structures including low temperature solder and structures formed therby |
| US10228735B2 (en) * | 2017-06-29 | 2019-03-12 | Intel Corporation | Methods of direct cooling of packaged devices and structures formed thereby |
| US10424527B2 (en) * | 2017-11-14 | 2019-09-24 | International Business Machines Corporation | Electronic package with tapered pedestal |
| US11682605B2 (en) * | 2019-05-28 | 2023-06-20 | Intel Corporation | Integrated circuit packages with asymmetric adhesion material regions |
-
2023
- 2023-01-12 EP EP23703988.8A patent/EP4466734A1/en active Pending
- 2023-01-12 KR KR1020247027012A patent/KR20240137605A/ko active Pending
- 2023-01-12 US US18/728,985 patent/US20250105085A1/en active Pending
- 2023-01-12 WO PCT/US2023/010702 patent/WO2023141052A1/en not_active Ceased
- 2023-01-12 CN CN202380023357.9A patent/CN118749132A/zh active Pending
- 2023-01-12 JP JP2024542242A patent/JP2025502980A/ja active Pending
- 2023-01-16 TW TW112101744A patent/TW202341371A/zh unknown
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