KR20240137605A - 하나 이상의 집적 회로 구성요소에 냉각 솔루션을 적용하고 집적 회로 냉각을 위해 조립하는 방법 - Google Patents

하나 이상의 집적 회로 구성요소에 냉각 솔루션을 적용하고 집적 회로 냉각을 위해 조립하는 방법 Download PDF

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Publication number
KR20240137605A
KR20240137605A KR1020247027012A KR20247027012A KR20240137605A KR 20240137605 A KR20240137605 A KR 20240137605A KR 1020247027012 A KR1020247027012 A KR 1020247027012A KR 20247027012 A KR20247027012 A KR 20247027012A KR 20240137605 A KR20240137605 A KR 20240137605A
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KR
South Korea
Prior art keywords
integrated circuit
heat spreader
solder
cooling plate
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247027012A
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English (en)
Korean (ko)
Inventor
모하메드 하이삼 헬미 나살
스리구마르 세샤사이 아이엔가
아이딘 나보바티
수렌드라팔 싱 자살
알렉산더 플라브시치
Original Assignee
테슬라, 인크.
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Publication date
Application filed by 테슬라, 인크. filed Critical 테슬라, 인크.
Publication of KR20240137605A publication Critical patent/KR20240137605A/ko
Pending legal-status Critical Current

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Classifications

    • H01L23/42—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H01L21/4882—
    • H01L21/563—
    • H01L23/3157—
    • H01L23/3675—
    • H01L23/373—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020247027012A 2022-01-19 2023-01-12 하나 이상의 집적 회로 구성요소에 냉각 솔루션을 적용하고 집적 회로 냉각을 위해 조립하는 방법 Pending KR20240137605A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263301003P 2022-01-19 2022-01-19
US63/301,003 2022-01-19
PCT/US2023/010702 WO2023141052A1 (en) 2022-01-19 2023-01-12 A method for applying a cooling solution to one or more integrated circuit components and assemble for integrated circuit cooling

Publications (1)

Publication Number Publication Date
KR20240137605A true KR20240137605A (ko) 2024-09-20

Family

ID=85199433

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247027012A Pending KR20240137605A (ko) 2022-01-19 2023-01-12 하나 이상의 집적 회로 구성요소에 냉각 솔루션을 적용하고 집적 회로 냉각을 위해 조립하는 방법

Country Status (7)

Country Link
US (1) US20250105085A1 (https=)
EP (1) EP4466734A1 (https=)
JP (1) JP2025502980A (https=)
KR (1) KR20240137605A (https=)
CN (1) CN118749132A (https=)
TW (1) TW202341371A (https=)
WO (1) WO2023141052A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250069978A1 (en) * 2023-08-23 2025-02-27 SK Hynix NAND Product Solutions Corp. (dba Solidigm) Thermal spreader
US20250112110A1 (en) * 2023-10-02 2025-04-03 Stmicroelectronics International N.V. Thermally enhanced flip chip ball grid array package with improved heat dissipation
DE102023129490A1 (de) * 2023-10-25 2025-04-30 TRUMPF Hüttinger GmbH + Co. KG Hochfrequenzverstärkeranordnung
US20250246501A1 (en) * 2024-01-25 2025-07-31 Apple Inc. Integrated circuit assembly with die coupled to lid
CN118673865B (zh) * 2024-08-02 2025-06-17 深圳陕煤高新技术研究院有限公司 双面散热封装器件参数确定方法、系统、设备及存储介质
TWI906171B (zh) * 2025-04-08 2025-11-21 技嘉科技股份有限公司 電子裝置及防護組件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306954A (ja) * 1996-05-20 1997-11-28 Hitachi Ltd 半導体装置及びその実装方法並びに実装構造体
US6504242B1 (en) * 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having a wetting layer on a thermally conductive heat spreader
US20050121776A1 (en) * 2003-12-05 2005-06-09 Deppisch Carl L. Integrated solder and heat spreader fabrication
US20080157345A1 (en) * 2006-12-29 2008-07-03 Daoqiang Lu Curved heat spreader design for electronic assemblies
US9064971B2 (en) * 2012-12-20 2015-06-23 Intel Corporation Methods of forming ultra thin package structures including low temperature solder and structures formed therby
US10228735B2 (en) * 2017-06-29 2019-03-12 Intel Corporation Methods of direct cooling of packaged devices and structures formed thereby
US10424527B2 (en) * 2017-11-14 2019-09-24 International Business Machines Corporation Electronic package with tapered pedestal
US11682605B2 (en) * 2019-05-28 2023-06-20 Intel Corporation Integrated circuit packages with asymmetric adhesion material regions

Also Published As

Publication number Publication date
WO2023141052A9 (en) 2024-08-08
CN118749132A (zh) 2024-10-08
US20250105085A1 (en) 2025-03-27
JP2025502980A (ja) 2025-01-30
EP4466734A1 (en) 2024-11-27
TW202341371A (zh) 2023-10-16
WO2023141052A1 (en) 2023-07-27

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