JP2025184031A - 電子デバイス - Google Patents

電子デバイス

Info

Publication number
JP2025184031A
JP2025184031A JP2024092074A JP2024092074A JP2025184031A JP 2025184031 A JP2025184031 A JP 2025184031A JP 2024092074 A JP2024092074 A JP 2024092074A JP 2024092074 A JP2024092074 A JP 2024092074A JP 2025184031 A JP2025184031 A JP 2025184031A
Authority
JP
Japan
Prior art keywords
conductive post
electronic component
adapter
electronic device
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024092074A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025184031A5 (https=
Inventor
臣哉 佐藤
Shinya Sato
政樹 橘▲高▼
Masaki KITTAKA
拓也 津野田
Takuya Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Torex Semiconductor Ltd
Original Assignee
Torex Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Torex Semiconductor Ltd filed Critical Torex Semiconductor Ltd
Priority to JP2024092074A priority Critical patent/JP2025184031A/ja
Priority to PCT/JP2025/015852 priority patent/WO2025253810A1/ja
Priority to TW114116630A priority patent/TW202549106A/zh
Publication of JP2025184031A publication Critical patent/JP2025184031A/ja
Publication of JP2025184031A5 publication Critical patent/JP2025184031A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2024092074A 2024-06-06 2024-06-06 電子デバイス Pending JP2025184031A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2024092074A JP2025184031A (ja) 2024-06-06 2024-06-06 電子デバイス
PCT/JP2025/015852 WO2025253810A1 (ja) 2024-06-06 2025-04-24 電子デバイス
TW114116630A TW202549106A (zh) 2024-06-06 2025-05-02 電子元件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024092074A JP2025184031A (ja) 2024-06-06 2024-06-06 電子デバイス

Publications (2)

Publication Number Publication Date
JP2025184031A true JP2025184031A (ja) 2025-12-18
JP2025184031A5 JP2025184031A5 (https=) 2026-03-05

Family

ID=97960465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024092074A Pending JP2025184031A (ja) 2024-06-06 2024-06-06 電子デバイス

Country Status (3)

Country Link
JP (1) JP2025184031A (https=)
TW (1) TW202549106A (https=)
WO (1) WO2025253810A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495392B1 (https=) * 1969-08-30 1974-02-06
JP4405253B2 (ja) * 2003-03-19 2010-01-27 日本特殊陶業株式会社 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP6283131B1 (ja) * 2017-01-31 2018-02-21 株式会社加藤電器製作所 電子デバイス及び電子デバイスの製造方法
JP7332094B2 (ja) * 2019-05-29 2023-08-23 日清紡マイクロデバイス株式会社 電子回路装置

Also Published As

Publication number Publication date
WO2025253810A1 (ja) 2025-12-11
TW202549106A (zh) 2025-12-16

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