Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations

Definitions

• the present invention relates to electronic devices.
• the present invention was made in consideration of these points, and aims to provide an electrical device that can shorten development time and is capable of handling large currents and high voltages.
• an electronic device for solving the above problem comprises a first electronic component and an adapter having a housing portion for housing the first electronic component, the adapter having an adapter body having a first surface and a second surface opposite the first surface in the thickness direction of the adapter, and a conductive post penetrating the adapter body from the first surface to the second surface, the housing portion being formed as a recess on the first surface, and a mounting portion on the second surface on which a second electronic component is mounted.
• the conductive post may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the housing portion interposed therebetween, and the second electronic component mounted on the mounting portion may be electrically connected to the first conductive post and the second conductive post.
• the conductive posts may include a first conductive post and a second conductive post disposed on the opposite side of the first conductive post with the housing portion interposed therebetween;
• the adapter body may be divided into a plurality of components, the plurality of components including a first member on which the first conductive post is disposed and a second member on which the second conductive post is disposed;
• the first member may have a first thick portion where the first conductive post is disposed and a first extending portion extending from the first thick portion toward the second member;
• the second member may have a second thick portion where the second conductive post is disposed and a second extending portion extending from the second thick portion toward the first member;
• the first extending portion and the second extending portion may extend to cover the first electronic component; and a gap may be formed between the first extending portion and the second extending portion when the electronic device is assembled.
• the gap may extend from one end face of the adapter body to the other end face, forming a heat dissipation path through which air can flow.
• the heat dissipation passage may face a portion of the outer surface of the second electronic component.
• the heat dissipation passage may be formed between the first extension portion and the second extension portion.
• the adapter may further have at least one of a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed on the second surface of the mounting portion, and a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed on the second surface of the mounting portion.
• the adapter may further have another mounting portion on the second surface on which a third electronic component is mounted, the third electronic component having electrodes on both ends, the distance between the electrodes being shorter than the distance between the electrodes of the second electronic component.
• the adapter may further include a connection electrode portion extending from the conductive post toward the side end surface of the adapter body and exposed at the side end surface.
• the present invention has the effect of shortening development time and providing electrical devices that can handle large currents and high voltages.
• FIG. 1 is a diagram illustrating an electronic device according to a first embodiment.
• FIG. 2 is a diagram illustrating the electronic device of FIG. 1.
• FIG. 10 is a diagram illustrating an electronic device according to a second embodiment.
• FIG. 4 shows the electronic device of FIG. 3 in an exploded state.
• FIG. 10 is a diagram illustrating an electronic device according to a third embodiment.
• FIG. 11 is a diagram illustrating a modified example of the third embodiment.
• FIG. 10 is a diagram illustrating an electronic device according to a fourth embodiment. 8 is a cross-sectional view taken along line BB in FIG. 7.
• FIG. 10 is a diagram showing an electronic device according to a modified example of the present invention.
• Fig. 1 is a diagram showing an electronic device of a first embodiment.
• Fig. 1(a) is a side view
• Fig. 1(b) is a cross-sectional view taken along line A-A in Fig. 2.
• Fig. 2 is a diagram showing the electronic device of Fig. 1.
• Fig. 2(a) is a plan view
• Fig. 2(b) is a bottom view.
• up, down, left, right, front, and back are used to indicate directions in accordance with the orientation of objects depicted in the drawings, but these terms are not intended to limit the present invention.
• the up and down directions correspond to the thickness direction of the electronic device and adapter.
• the electronic device S100 is a single packaged device and includes a first electronic component 10, a second electronic component 20, and an adapter 30.
• the first electronic component 10 is any electronic component, and in this embodiment, as an example, it is a DFN (Dual-Flat No-Leads) type component.
• the first electronic component 10 has a structure in which a semiconductor chip is molded with resin.
• the first electronic component 10 has a rectangular parallelepiped shape, and has a rectangular outline shape in plan view as shown in Figure 2(b).
• the first electronic component 10 is not limited to a specific thickness, but as an example, it is 1 mm or less, and more specifically, for example, 0.7 mm or less.
• a plurality of terminals 11 are formed on the underside of the first electronic component 10.
• the terminals 11 are formed from a conductive material and are electrically connected to the internal semiconductor chip.
• the terminals 11 are exposed on the bottom and side surfaces of the first electronic component 10.
• the terminals 11 are soldered to a predetermined printed circuit board, for example.
• the first electronic component 10 forms part of the outer shape of the electronic device S100, it can also be said that the terminals 11 are exposed on the bottom and side surfaces of the electronic device S100.
• the second electronic component 20 is disposed on the upper surface of the adapter 30.
• the second electronic component 20 may be any electronic component, such as an inductor, capacitor, resistor, or semiconductor device.
• the second electronic component 20 is, for example, a coil (chip inductor).
• the second electronic component 20 has a main body 21 and a pair of electrodes 22.
• the use of the electronic device S100 is not particularly limited, but by mounting such a chip inductor in a configuration in which a semiconductor chip including a transistor that switches current is built into the electronic device S100, a small DC/DC converter can be constructed.
• the adapter 30 is a member to which the first electronic component 10 and the second electronic component 20 are fixed.
• the adapter 30 has a rectangular or approximately rectangular parallelepiped outer shape.
• the adapter 30 has an adapter main body 31 and conductive posts 38.
• the adapter body 31 has a first surface 31a, which is the bottom surface, a second surface 31b, which is the top surface, a front surface 31c, a back surface 31d, a first side surface 31e, and a second side surface 31f.
• the second surface 31b is the surface opposite the first surface 31a in the thickness direction of the adapter 30.
• a storage section 35 is formed on the first surface 31a of the adapter 30.
• the storage section 35 is a portion that stores the first electronic component 10.
• the storage section 35 is a recess that has a rectangular cross section in the thickness direction of the electronic device S100 and extends in a straight line from the front surface 31c to the back surface 31d.
• the storage section 35 is formed to a depth that prevents the bottom surface of the first electronic component 10 from protruding from the first surface 31a when the first electronic component 10 is placed inside the recess.
• the accommodating portion 35 can be formed by any processing process, and as an example, it may be formed by making cuts in the first surface 31a of the adapter body 31 using a dicer.
• the accommodation portion 35 is a recess connecting the front surface 31c and the back surface 31d.
• the accommodation portion 35 does not have to be exposed on the side surface of the adapter 30.
• the accommodation portion 35 may be a recess carved from the first surface 31a in the thickness direction of the adapter 30, and not exposed on any of the front surface 31c, back surface 31d, first side surface 31e, and second side surface 31f of the adapter body 31. Any manufacturing method can be used to form such a recess; for example, the recess may be formed using a mold, or the recess may be formed by machining using an end mill or the like.
• the second surface 31b has a mounting area P1 on which the second electronic component 20 is mounted.
• This mounting area P1 is an area that includes the area on which the second electronic component 20 is placed and the top surfaces of the two conductive posts 38.
• the conductive posts 38 are conductive members that penetrate the adapter body 31.
• One example of the material for the conductive posts 38 is copper.
• a first conductive post 38-1 and a second conductive post 38-2 are provided as the conductive posts 38.
• the first conductive post 38-1 is provided on the left side of FIG. 1, and the second conductive post 38-2 is provided on the right side of FIG. 1, i.e., on the opposite side of the first conductive post 38-1 with the housing portion 35 in between. Because the first conductive post 38-1 and the second conductive post 38-2 have the same structure, they will not be distinguished from each other below and will be simply referred to as conductive posts 38.
• the conductive post 38 is formed to penetrate from the first surface 31a to the second surface 31b of the adapter body 31.
• the upper surface of the conductive post 38 is exposed on the second surface 31b, and the lower surface of the conductive post 38 is exposed on the first surface 31a.
• the upper surface of the conductive post 38 functions as a land for mounting the second electronic component 20.
• the lower surface of the conductive post 38 is electrically connected to the circuit pattern of a specified substrate.
• each electrode 22 of the second electronic component 20 is electrically connected to each conductive post 38.
• the electrodes 22 and conductive posts 38 may be electrically connected by any means, but in this embodiment, this is done by solder, for example.
• the horizontal cross-sectional shape (transverse cross-sectional shape) of the conductive post 38 may be any shape, such as a rectangle, polygon, or circle, but in this example it is a rectangle.
• the conductive posts 38 are embedded inside the adapter body 31.
• the conductive posts 38 are not exposed on any of the front surface 31c, back surface 31d, first side surface 31e, and second side surface 31f. Because the conductive posts 38 are not exposed on the side surfaces of the electronic device S100, signals flowing through the conductive posts 38 are unlikely to appear on the side surfaces of the electronic device S100. Therefore, even if another electronic device is placed near the electronic device S100, the current flowing through the conductive posts 38 has little effect on the other electronic device S100.
• This configuration has the advantage of allowing the device in which the electronic device S100 is mounted to be miniaturized.
• the cross-sectional area of the conductive post 38 in the horizontal direction i.e., the direction parallel to the first surface 31a or the second surface 31b (see, for example, Figure 2(b)), is relatively large. Furthermore, the horizontal cross-sectional area of the conductive post 38 is, for example, 5% or more, and preferably 10% or more, of the area of the adapter body 31 in a planar view.
• the front-to-rear dimension of the conductive post 38 is, for example, 1/4 or more, and preferably 1/3 or more, of the front-to-rear dimension of the adapter body 31.
• the left-to-right (width) dimension of the conductive post 38 is, for example, 1/10 or more of the left-to-right (width) dimension of the adapter body 31.
• the cross-sectional area of the conductive post 38 is large, and the current capacity of the conductive post 38 is large, making it possible to mount a second electronic component 20 through which a large current flows on the adapter 30.
• the conductive post 38 has a higher thermal conductivity than the resin material, the conductive post 38 functions as a heat dissipation member, effectively dissipating heat from the electronic device S100.
• the upper surfaces of the conductive posts 38 are partially exposed on the upper surface of the adapter 30, allowing for effective heat dissipation.
• heat from the conductive posts 38 can also be dissipated outside the device through the pattern of the board on which the electronic device S100 is mounted.
• the horizontal area of the conductive post 38 be formed large as described above, but the present invention is not limited to this, and the horizontal cross-sectional area of the conductive post 38 may be smaller than the above range.
• the lower surfaces of the conductive posts 38 and the plurality of terminals 11 function as external terminals of the electronic device S100. That is, the lower surfaces of the conductive posts 38 and the plurality of terminals 11 are electrically connected to a circuit pattern of a predetermined substrate, thereby mounting the electronic device S100 on the predetermined substrate.
• the terminals 11 of the first electronic component 10 housed in the housing portion 35 of the adapter body 31 can be used as external terminals of the electronic device S100. Therefore, unlike conventional structures in which electronic components are molded, it is not necessary to create a connection circuit to connect the first electronic component 10 and the external terminals of the electronic device S100. Therefore, for example, since it is possible to use an existing first electronic component 10 as is, the development period for the electronic device S100 can be shortened.
• the cross-sectional area (horizontal cross-sectional area) of the conductive post 38 is large, so in a configuration in which the second electronic component 20 is electrically connected to the first conductive post 38-1 and the second conductive post 38-2, it is possible to accommodate a second electronic component 20 with a large current and high withstand voltage.
• the conductive post 38 has a higher thermal conductivity than resin materials, and in this embodiment in particular, the upper surface of the conductive post 38 is exposed to the second surface 31b of the adapter 30, allowing for effective dissipation of heat from the electronic device S100.
• the storage section 35 is formed to extend from the front surface 31c to the back surface 31d.
• This configuration has the advantage that the storage section 35, which is a recess, can be easily formed by processing with a dicer or the like.
• the electronic device of one embodiment of the present invention may be configured as follows.
• Figure 3 is a diagram showing an electronic device of the second embodiment.
• Figure 4 is a diagram showing the electronic device of Figure 3 in an exploded state.
• the electronic device S101 includes a first electronic component 10, a second electronic component 20, and an adapter 130. Except for the fact that the adapter 130 has a different structure from the adapter 30 of the first embodiment, the electronic device S101 has the same configuration as the electronic device S100 of the first embodiment.
• the adapter 130 comprises a first adapter body 131-1, a first conductive post 38-1, a second adapter body 131-2, and a second conductive post 38-2.
• the adapter 130 is divided into multiple components. Because the first adapter body 131-1 and the second adapter body 131-2 are symmetrical in shape, the following explanation will use the first adapter body 131-1 as an example.
• the first adapter body 131-1 is the first member that constitutes the adapter body 131, and has a first thick portion 132-1 and a first extending portion 133-1.
• the first thick portion 132-1 is the portion where the first conductive post 38-1 is provided.
• the first thick portion 132-1 corresponds to the portion of the adapter body 31 adjacent to the side of the accommodation portion 35.
• the first extension portion 133-1 corresponds to a portion of the adapter body 31 above the accommodating portion 35 in the adapter body 31 of the first embodiment.
• the first extension portion 133-1 extends horizontally from the upper end of the first thick portion 132-1 toward the second adapter body 131-2.
• the first extension portion 133-1 partially covers the top surface of the first electronic component 10.
• the second adapter body 131-2 is configured in the same manner as the first adapter body 131-1.
• the second adapter body 131-2 is the second member that constitutes the adapter body 131, and has a second thick portion 132-2 and a second extension portion 133-2.
• the second thick portion 132-2 is the portion where the second conductive post 38-2 is provided.
• the second extension portion 133-2 extends from the second thick portion 132-2 toward the first adapter body 131-1.
• the first extending portion 133-1 and the second extending portion 133-2 extend so as to cover the first electronic component 10, and when the electronic device S101 is in an assembled state, a gap Sa is formed between the first extending portion 133-1 and the second extending portion 133-2.
• the tip of the first extending portion 133-1 and the tip of the second extending portion 133-2 are not in contact with each other, and a gap Sa is formed between them.
• the top surface of the first electronic component 10 is fixed to the first extension portion 133-1 and the second extension portion 133-2.
• An adhesive may be used for fixing.
• the gap Sa extends from one end face of the adapter body 131 (the front face 31c of the adapter body 31) to the other end face (the back face 31d of the adapter body 31).
• the gap Sa forms a heat dissipation path that allows air to flow from one end face of the adapter body 131 to the other end face.
• the gap Sa extends so as to face a portion of the outer surface (top face) of the first electronic component 10.
• the gap Sa also extends so as to face a portion of the outer surface (bottom face) of the second electronic component 20.
• the gap Sa is provided in this manner, forming a heat dissipation path that dissipates heat from the first electronic component 10 and/or the second electronic component 20, thereby enabling efficient dissipation of heat during operation of the electronic device S101.
• the manufacture of the electronic device S101 will be briefly described with reference to Figure 4.
• the first adapter body 131-1 and the second adapter body 131-2 can be produced, for example, by cutting the thin-walled portion (the portion above the accommodating portion 35) of the adapter body 31 of the first embodiment.
• the first adapter body 131-1 and the second adapter body 131-2 are arranged to sandwich the first electronic component 10 from both sides.
• the second electronic component 20 is placed on the upper surfaces of the first adapter body 131-1 and the second adapter body 131-2.
• the electronic device S101 is then manufactured by electrically connecting each electrode 22 of the second electronic component 20 to each conductive post 38.
• the first electronic component 10 is fixed to each member by being sandwiched between the first adapter body 131-1 and the second adapter body 131-2. This makes it possible to easily attach first electronic components 10 of various sizes to the adapter 130, eliminating the need to prepare multiple adapters 130 with different shaped accommodation sections 35.
• a gap Sa is formed between the first extension portion 133-1 and the second extension portion 133-2.
• This gap Sa functions as a heat dissipation path, allowing heat to be efficiently dissipated during operation of the electronic device S101. If the gap Sa is formed to extend from the front to the back of the adapter 130, that is, if the ends of the heat dissipation path are exposed to the front and back of the adapter 130, heat can be dissipated particularly efficiently through the ends of this heat dissipation path. Heat can also be efficiently dissipated by flowing air through the gap Sa.
• the gap Sa has been explained above, but the main feature of the second embodiment is that the first electronic component 10 is sandwiched between a pair of adapter bodies 131, and it is not an essential component that the gap Sa be hollow.
• the gap Sa may be filled with a material such as adhesive.
• the adapter in the electronic device of the present invention can mount second electronic components 20 of various sizes.
• the conductive posts 38 are formed with a relatively large horizontal cross-sectional area and a long width (the dimension in the left-right direction in FIG. 1 ), so even with the configurations of the first and second embodiments, it is possible to mount second electronic components 20 of a certain degree of different sizes.
• the electronic device may be configured as follows.
• FIG. 5 shows an electronic device according to the third embodiment.
• FIG. 5(a) is a cross-sectional view
• FIG. 5(b) is a plan view with the second electronic component 20 omitted.
• the electronic device S102 has a similar basic structure to the electronic device S100 according to the first embodiment, but differs in that it has a protruding electrode portion 39.
• the protruding electrode portion 39 includes a first protruding electrode 39-1 and a second protruding electrode 39-2.
• the first protruding electrode 39-1 is formed so as to protrude from the first conductive post 38-1 toward the second conductive post 38-2.
• the first protruding electrode 39-1 is formed so as to extend to the area above the first electronic component 10.
• the first protruding electrode 39-1 is exposed on the second surface 31b of the adapter in the mounting portion where the second electronic component 20 is mounted.
• the second protruding electrode 39-2 similarly protrudes from the second conductive post 38-2 toward the first conductive post 38-1, with its upper surface exposed on the second surface 31b.
• the formation of the protruding electrode portion 39 means that in addition to the top surface of the conductive post 38, the top surface of the protruding electrode portion 39 also serves as a land to which the electrode of the second electronic component can be connected, thereby increasing the area of the land and enabling the mounting of second electronic components of various sizes.
• the protruding electrode portion 39 which is made of a conductive material, can also function as a shielding member for the first electronic component 10, this configuration is expected to have the effect of reducing the mutual influence of electronic components due to electromagnetic wave leakage.
• FIG. 6 shows a modified example of the third embodiment.
• the above-described configuration may be applied to a configuration similar to the second embodiment in which a gap Sa is formed, as shown in FIG. 6.
• Fig. 7 is a diagram showing an electronic device of a fourth embodiment.
• Fig. 8 is a cross-sectional view taken along line BB in Fig. 7.
• the electronic device S103 includes a first electronic component 10, a second electronic component 20, a third electronic component 50, and an adapter 230. Except for the inclusion of the third electronic component 50 and the fact that the adapter 230 is provided with a structural portion electrically connected to the third electronic component 50, the basic structure is the same as that of the first embodiment, and therefore a redundant description will be omitted. Note that, while an example sharing a basic structure with the first embodiment will be described here, the configuration in which the third electronic component 50 is provided may be combined with the configuration of the second embodiment, for example.
• third electronic component 50-1 and third electronic component 50-2 are provided: third electronic component 50-1 and third electronic component 50-2. Because third electronic component 50-1 and third electronic component 50-2 have the same configuration, the following will describe third electronic component 50-1.
• third electronic component 50 is an electronic component that is smaller (meaning smaller in volume or smaller in outline in plan view) than first electronic component 10 and second electronic component 20.
• the third electronic component 50 may be any electronic component, but is, for example, a chip capacitor. Electrodes are provided on both ends of the third electronic component 50. The distance between the electrodes of the third electronic component 50 is shorter than the distance between the electrodes of the second electronic component 20.
• the adapter 230 has a mounting portion P2 on which the third electronic component 50 is mounted.
• the mounting portion P2 is provided on the top surface (second surface) of the adapter 230.
• one mounting portion P2 is provided on the front side and one on the back side of the adapter 230, but the present invention is not limited to this.
• the adapter 230 also has a conductive member 240 formed thereon, which is connected to the third electronic component 50.
• the conductive member 240 includes a first conductive member 240-1 and a second conductive member 240-2. Since the first conductive member 240-1 and the second conductive member 240-2 have a similar structure, the following description will use the first conductive member 240-1 as an example.
• the first conductive member 240-1 has a through electrode portion 245 and a protruding electrode portion 246.
• One example of the material for the first conductive member 240-1 is copper.
• the through-hole electrode portion 245 is formed to penetrate the adapter 230 in its thickness direction.
• the upper surface of the through-hole electrode portion 245 is exposed at the upper surface of the adapter 230, and the lower surface of the through-hole electrode portion 245 is exposed at the lower surface of the adapter 230.
• the protruding electrode portion 246 is an electrode that extends from the upper end of the through electrode portion 245 toward the second conductive member 240-2.
• the upper surface of the protruding electrode portion 246 is exposed on the upper surface of the adapter 230.
• the protruding electrode portion 246 of the second conductive member 240-2 is configured in a similar manner.
• the third electronic component 50 is mounted on the pair of protruding electrode portions 246 formed in this manner. The electrode portions at the ends of the third electronic component 50 are each electrically connected to the protruding electrode portions 246.
• the electronic device S100 can be made more highly functional.
• FIG. 9 shows a modified example of an electronic device according to the present invention. All of the electrical devices in FIG. 9 are examples in which electrodes are provided near the conductive posts 38 of the electronic device S100 in FIG. 1. As shown in FIG. 9(a), an electronic device according to one embodiment of the present invention may have a connection electrode portion 41.
• connection electrode portion 41 is an electrode portion provided inside the adapter 30.
• the connection electrode portion 41 includes a first connection electrode portion 41-1 and a second connection electrode portion 41-2, but since these have a similar structure, the following explanation will use the first connection electrode portion 41-1 as an example.
• the first connection electrode portion 41-1 is provided on the lower side of the conductive post 38 and extends from the first conductive post 38-1 toward the side end face (first side surface 31e) of the adapter body 31. The end face of the first connection electrode portion 41-1 is exposed on the first side surface 31e.
• the second connection electrode portion 41-2 extends from the second conductive post 38-2 toward the second side surface 31f.
• the end face of the second connection electrode portion 41-2 is exposed on the second side surface 31f.
• connection electrode portion 41 can be used as an external connection terminal for the electronic device, making it easier to electrically connect the electronic device to other devices or circuit patterns.
• connection electrode portion 41 may be provided in a position as shown in FIG. 9(b) instead of the position as shown in FIG. 9(a). Specifically, in the electronic device of FIG. 9(b), the connection electrode portion 41 is provided at the midpoint in the height direction of the conductive post 38. The connection electrode portion 41 is exposed on the first side surface 31e, but is not exposed on either the first surface 31a or the second surface 31b. In other words, the resin member of the adapter 30 is present above and below the connection electrode portion 41.
• connection electrode portion 41 when manufacturing an electronic device (specifically, when cutting the adapter 30 from a specified component). Specifically, when attempting to cut the adapter 30 from its top surface to its bottom surface using, for example, a dicer, the connection electrode portion 41, which is made of a material such as copper, may not be cut cleanly, and burrs may be generated on the bottom end of the connection electrode portion 41.
• connection electrode portion 41 is located at the midpoint in the height direction of the conductive post 38 and the top and bottom of the connection electrode portion 41 are sandwiched between molding material, is advantageous in that burrs are less likely to occur compared to the configuration in Figure 9(a).
• burrs are less likely to protrude downward from the underside of the device, and problems such as the device floating above the mounting surface when mounted are less likely to occur.
• First electronic component 11 Terminal 20 Second electronic component 21 Main body 22 Electrode 30 Adapter 31 Adapter main body 31a First surface 31b Second surface 31c Front surface 31d Back surface 31e First side surface 31f Second side surface 35 Accommodating section 38 Conductive post 38-1 First conductive post 38-2 Second conductive post 39 Protruding electrode section 39-1 First protruding electrode 39-2 Second protruding electrode 41 Connecting electrode section 41-1 First connecting electrode section 41-2 Second connecting electrode section 50 Third electronic component 130 Adapter 131 Adapter main body 131-1 First adapter main body 131-2 Second adapter main body 132-1 First thick portion 132-2 Second thick portion 133-2 Second extending portion 230 Adapter 240 Conductive member 245 Through electrode section 246 Protruding electrode sections P1, P2 Mounting section S100 Electronic device S101 Electronic device S102 Electronic device S103 Electronic device Sa Air gap

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Citations (4)

• 2024
  • 2024-06-06 JP JP2024092074A patent/JP2025184031A/ja active Pending
• 2025
  • 2025-04-24 WO PCT/JP2025/015852 patent/WO2025253810A1/ja active Pending
  • 2025-05-02 TW TW114116630A patent/TW202549106A/zh unknown

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