TW202549106A - 電子元件 - Google Patents

電子元件

Info

Publication number
TW202549106A
TW202549106A TW114116630A TW114116630A TW202549106A TW 202549106 A TW202549106 A TW 202549106A TW 114116630 A TW114116630 A TW 114116630A TW 114116630 A TW114116630 A TW 114116630A TW 202549106 A TW202549106 A TW 202549106A
Authority
TW
Taiwan
Prior art keywords
electronic component
conductive post
adapter
component
adapter body
Prior art date
Application number
TW114116630A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤臣哉
橘高政樹
津野田拓也
Original Assignee
日商特瑞仕半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商特瑞仕半導體股份有限公司 filed Critical 日商特瑞仕半導體股份有限公司
Publication of TW202549106A publication Critical patent/TW202549106A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
TW114116630A 2024-06-06 2025-05-02 電子元件 TW202549106A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024092074A JP2025184031A (ja) 2024-06-06 2024-06-06 電子デバイス
JP2024-092074 2024-06-06

Publications (1)

Publication Number Publication Date
TW202549106A true TW202549106A (zh) 2025-12-16

Family

ID=97960465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114116630A TW202549106A (zh) 2024-06-06 2025-05-02 電子元件

Country Status (3)

Country Link
JP (1) JP2025184031A (https=)
TW (1) TW202549106A (https=)
WO (1) WO2025253810A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495392B1 (https=) * 1969-08-30 1974-02-06
JP4405253B2 (ja) * 2003-03-19 2010-01-27 日本特殊陶業株式会社 中継基板、半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP6283131B1 (ja) * 2017-01-31 2018-02-21 株式会社加藤電器製作所 電子デバイス及び電子デバイスの製造方法
JP7332094B2 (ja) * 2019-05-29 2023-08-23 日清紡マイクロデバイス株式会社 電子回路装置

Also Published As

Publication number Publication date
JP2025184031A (ja) 2025-12-18
WO2025253810A1 (ja) 2025-12-11

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