JP2025088549A5 - - Google Patents

Info

Publication number
JP2025088549A5
JP2025088549A5 JP2023203323A JP2023203323A JP2025088549A5 JP 2025088549 A5 JP2025088549 A5 JP 2025088549A5 JP 2023203323 A JP2023203323 A JP 2023203323A JP 2023203323 A JP2023203323 A JP 2023203323A JP 2025088549 A5 JP2025088549 A5 JP 2025088549A5
Authority
JP
Japan
Prior art keywords
bridge
wiring
layer
opposing portion
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023203323A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025088549A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2023203323A priority Critical patent/JP2025088549A/ja
Priority claimed from JP2023203323A external-priority patent/JP2025088549A/ja
Priority to PCT/JP2024/039126 priority patent/WO2025115521A1/ja
Priority to TW113145309A priority patent/TW202527314A/zh
Publication of JP2025088549A publication Critical patent/JP2025088549A/ja
Publication of JP2025088549A5 publication Critical patent/JP2025088549A5/ja
Pending legal-status Critical Current

Links

JP2023203323A 2023-11-30 2023-11-30 電子装置 Pending JP2025088549A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023203323A JP2025088549A (ja) 2023-11-30 2023-11-30 電子装置
PCT/JP2024/039126 WO2025115521A1 (ja) 2023-11-30 2024-11-01 電子装置
TW113145309A TW202527314A (zh) 2023-11-30 2024-11-25 電子裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023203323A JP2025088549A (ja) 2023-11-30 2023-11-30 電子装置

Publications (2)

Publication Number Publication Date
JP2025088549A JP2025088549A (ja) 2025-06-11
JP2025088549A5 true JP2025088549A5 (https=) 2026-02-27

Family

ID=95897634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023203323A Pending JP2025088549A (ja) 2023-11-30 2023-11-30 電子装置

Country Status (3)

Country Link
JP (1) JP2025088549A (https=)
TW (1) TW202527314A (https=)
WO (1) WO2025115521A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234270B2 (ja) * 1999-07-16 2009-03-04 浜松ホトニクス株式会社 半導体装置の製造方法
JP6038517B2 (ja) * 2012-07-13 2016-12-07 新光電気工業株式会社 配線基板及びその製造方法
US9368450B1 (en) * 2015-08-21 2016-06-14 Qualcomm Incorporated Integrated device package comprising bridge in litho-etchable layer
US10535608B1 (en) * 2018-07-24 2020-01-14 International Business Machines Corporation Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
US12341129B2 (en) * 2019-06-13 2025-06-24 Intel Corporation Substrateless double-sided embedded multi-die interconnect bridge
US12027448B2 (en) * 2020-03-24 2024-07-02 Intel Corporation Open cavity bridge power delivery architectures and processes

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