TW202527314A - 電子裝置 - Google Patents

電子裝置 Download PDF

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Publication number
TW202527314A
TW202527314A TW113145309A TW113145309A TW202527314A TW 202527314 A TW202527314 A TW 202527314A TW 113145309 A TW113145309 A TW 113145309A TW 113145309 A TW113145309 A TW 113145309A TW 202527314 A TW202527314 A TW 202527314A
Authority
TW
Taiwan
Prior art keywords
bridge
wiring
layer
electronic component
electronic
Prior art date
Application number
TW113145309A
Other languages
English (en)
Chinese (zh)
Inventor
野中敏央
Original Assignee
日商Ｒａｐｉｄｕｓ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｒａｐｉｄｕｓ股份有限公司 filed Critical 日商Ｒａｐｉｄｕｓ股份有限公司
Publication of TW202527314A publication Critical patent/TW202527314A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW113145309A 2023-11-30 2024-11-25 電子裝置 TW202527314A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023-203323 2023-11-30
JP2023203323A JP2025088549A (ja) 2023-11-30 2023-11-30 電子装置
WOPCT/JP2024/039126 2024-11-01
PCT/JP2024/039126 WO2025115521A1 (ja) 2023-11-30 2024-11-01 電子装置

Publications (1)

Publication Number Publication Date
TW202527314A true TW202527314A (zh) 2025-07-01

Family

ID=95897634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113145309A TW202527314A (zh) 2023-11-30 2024-11-25 電子裝置

Country Status (3)

Country Link
JP (1) JP2025088549A (https=)
TW (1) TW202527314A (https=)
WO (1) WO2025115521A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234270B2 (ja) * 1999-07-16 2009-03-04 浜松ホトニクス株式会社 半導体装置の製造方法
JP6038517B2 (ja) * 2012-07-13 2016-12-07 新光電気工業株式会社 配線基板及びその製造方法
US9368450B1 (en) * 2015-08-21 2016-06-14 Qualcomm Incorporated Integrated device package comprising bridge in litho-etchable layer
US10535608B1 (en) * 2018-07-24 2020-01-14 International Business Machines Corporation Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
US12341129B2 (en) * 2019-06-13 2025-06-24 Intel Corporation Substrateless double-sided embedded multi-die interconnect bridge
US12027448B2 (en) * 2020-03-24 2024-07-02 Intel Corporation Open cavity bridge power delivery architectures and processes

Also Published As

Publication number Publication date
JP2025088549A (ja) 2025-06-11
WO2025115521A1 (ja) 2025-06-05

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