JP2025088548A5 - - Google Patents

Info

Publication number
JP2025088548A5
JP2025088548A5 JP2023203322A JP2023203322A JP2025088548A5 JP 2025088548 A5 JP2025088548 A5 JP 2025088548A5 JP 2023203322 A JP2023203322 A JP 2023203322A JP 2023203322 A JP2023203322 A JP 2023203322A JP 2025088548 A5 JP2025088548 A5 JP 2025088548A5
Authority
JP
Japan
Prior art keywords
bridge
electronic
layer
opposing portion
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023203322A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025088548A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2023203322A priority Critical patent/JP2025088548A/ja
Priority claimed from JP2023203322A external-priority patent/JP2025088548A/ja
Priority to PCT/JP2024/039125 priority patent/WO2025115520A1/ja
Priority to TW113145289A priority patent/TW202545041A/zh
Publication of JP2025088548A publication Critical patent/JP2025088548A/ja
Publication of JP2025088548A5 publication Critical patent/JP2025088548A5/ja
Pending legal-status Critical Current

Links

JP2023203322A 2023-11-30 2023-11-30 電子装置 Pending JP2025088548A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023203322A JP2025088548A (ja) 2023-11-30 2023-11-30 電子装置
PCT/JP2024/039125 WO2025115520A1 (ja) 2023-11-30 2024-11-01 電子装置
TW113145289A TW202545041A (zh) 2023-11-30 2024-11-25 電子裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023203322A JP2025088548A (ja) 2023-11-30 2023-11-30 電子装置

Publications (2)

Publication Number Publication Date
JP2025088548A JP2025088548A (ja) 2025-06-11
JP2025088548A5 true JP2025088548A5 (https=) 2026-02-27

Family

ID=95897661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023203322A Pending JP2025088548A (ja) 2023-11-30 2023-11-30 電子装置

Country Status (3)

Country Link
JP (1) JP2025088548A (https=)
TW (1) TW202545041A (https=)
WO (1) WO2025115520A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6038517B2 (ja) * 2012-07-13 2016-12-07 新光電気工業株式会社 配線基板及びその製造方法
US9368450B1 (en) * 2015-08-21 2016-06-14 Qualcomm Incorporated Integrated device package comprising bridge in litho-etchable layer
US10535608B1 (en) * 2018-07-24 2020-01-14 International Business Machines Corporation Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
TWI768294B (zh) * 2019-12-31 2022-06-21 力成科技股份有限公司 封裝結構及其製造方法
US12027448B2 (en) * 2020-03-24 2024-07-02 Intel Corporation Open cavity bridge power delivery architectures and processes
US20230207475A1 (en) * 2021-12-23 2023-06-29 Intel Corporation Hybrid bonded stacked memory with tsv as chiplet for package structure

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