JP2024537888A5 - - Google Patents
Info
- Publication number
- JP2024537888A5 JP2024537888A5 JP2024522015A JP2024522015A JP2024537888A5 JP 2024537888 A5 JP2024537888 A5 JP 2024537888A5 JP 2024522015 A JP2024522015 A JP 2024522015A JP 2024522015 A JP2024522015 A JP 2024522015A JP 2024537888 A5 JP2024537888 A5 JP 2024537888A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- weight
- composition
- filler
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2110895A FR3128224B1 (fr) | 2021-10-14 | 2021-10-14 | Composition Adhésive thermofusible |
| FR2110895 | 2021-10-14 | ||
| PCT/FR2022/051930 WO2023062324A1 (fr) | 2021-10-14 | 2022-10-13 | Composition adhésive thermofusible |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024537888A JP2024537888A (ja) | 2024-10-16 |
| JP2024537888A5 true JP2024537888A5 (enExample) | 2025-10-15 |
Family
ID=78770796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024522015A Pending JP2024537888A (ja) | 2021-10-14 | 2022-10-13 | ホットメルト接着剤組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250236773A1 (enExample) |
| EP (1) | EP4416232A1 (enExample) |
| JP (1) | JP2024537888A (enExample) |
| CN (1) | CN118103473A (enExample) |
| FR (1) | FR3128224B1 (enExample) |
| WO (1) | WO2023062324A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026109748A1 (fr) * | 2024-11-22 | 2026-05-28 | Arkema France | Composition pour une structure multicouche à base de polyamide utilisable en tant que carte |
| FR3168791A1 (fr) * | 2024-11-22 | 2026-05-29 | Arkema France | Structure multicouche à base de polyamide utilisable en tant que carte |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2671011A1 (en) * | 2006-11-29 | 2008-06-05 | Henkel Ag & Co. Kgaa | Molded parts from hot melt adhesives |
| US20120157600A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Molded thermoplastic articles comprising thermally conductive polymers |
| US8552101B2 (en) * | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| FR3023294B1 (fr) * | 2014-07-01 | 2018-07-13 | Arkema France | Polyamides a base d'aminoalkyl- ou aminoaryl- piperazine pour adhesifs thermofusibles |
| CN104356998A (zh) * | 2014-09-23 | 2015-02-18 | 苏州雷立特新材料科技有限公司 | 一种用于电子封装领域的聚酰胺热熔胶 |
| ES2914973T3 (es) * | 2015-03-05 | 2022-06-20 | Henkel Ag & Co Kgaa | Adhesivo termoconductor |
| CN105670550B (zh) * | 2016-03-31 | 2017-11-14 | 东莞新能源科技有限公司 | 一种导热胶及含有该导热胶的二次电池 |
| CN107880264B (zh) * | 2017-12-06 | 2020-12-01 | 华南协同创新研究院 | 一种石墨烯改性聚酰胺导热热熔胶及其制备方法 |
-
2021
- 2021-10-14 FR FR2110895A patent/FR3128224B1/fr active Active
-
2022
- 2022-10-13 CN CN202280068328.XA patent/CN118103473A/zh active Pending
- 2022-10-13 JP JP2024522015A patent/JP2024537888A/ja active Pending
- 2022-10-13 WO PCT/FR2022/051930 patent/WO2023062324A1/fr not_active Ceased
- 2022-10-13 US US18/698,068 patent/US20250236773A1/en active Pending
- 2022-10-13 EP EP22801844.6A patent/EP4416232A1/fr active Pending
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