FR3128224B1 - Composition Adhésive thermofusible - Google Patents

Composition Adhésive thermofusible Download PDF

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Publication number
FR3128224B1
FR3128224B1 FR2110895A FR2110895A FR3128224B1 FR 3128224 B1 FR3128224 B1 FR 3128224B1 FR 2110895 A FR2110895 A FR 2110895A FR 2110895 A FR2110895 A FR 2110895A FR 3128224 B1 FR3128224 B1 FR 3128224B1
Authority
FR
France
Prior art keywords
filler
hot melt
melt adhesive
adhesive composition
micrometers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2110895A
Other languages
English (en)
French (fr)
Other versions
FR3128224A1 (fr
Inventor
Thomas Prenveille
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bostik SA
Original Assignee
Arkema France SA
Bostik SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkema France SA, Bostik SA filed Critical Arkema France SA
Priority to FR2110895A priority Critical patent/FR3128224B1/fr
Priority to CN202280068328.XA priority patent/CN118103473A/zh
Priority to US18/698,068 priority patent/US20250236773A1/en
Priority to JP2024522015A priority patent/JP2024537888A/ja
Priority to EP22801844.6A priority patent/EP4416232A1/fr
Priority to PCT/FR2022/051930 priority patent/WO2023062324A1/fr
Publication of FR3128224A1 publication Critical patent/FR3128224A1/fr
Application granted granted Critical
Publication of FR3128224B1 publication Critical patent/FR3128224B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FR2110895A 2021-10-14 2021-10-14 Composition Adhésive thermofusible Active FR3128224B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR2110895A FR3128224B1 (fr) 2021-10-14 2021-10-14 Composition Adhésive thermofusible
CN202280068328.XA CN118103473A (zh) 2021-10-14 2022-10-13 热熔胶粘剂组合物
US18/698,068 US20250236773A1 (en) 2021-10-14 2022-10-13 Hot-melt adhesive composition
JP2024522015A JP2024537888A (ja) 2021-10-14 2022-10-13 ホットメルト接着剤組成物
EP22801844.6A EP4416232A1 (fr) 2021-10-14 2022-10-13 Composition adhésive thermofusible
PCT/FR2022/051930 WO2023062324A1 (fr) 2021-10-14 2022-10-13 Composition adhésive thermofusible

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2110895A FR3128224B1 (fr) 2021-10-14 2021-10-14 Composition Adhésive thermofusible
FR2110895 2021-10-14

Publications (2)

Publication Number Publication Date
FR3128224A1 FR3128224A1 (fr) 2023-04-21
FR3128224B1 true FR3128224B1 (fr) 2024-11-29

Family

ID=78770796

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2110895A Active FR3128224B1 (fr) 2021-10-14 2021-10-14 Composition Adhésive thermofusible

Country Status (6)

Country Link
US (1) US20250236773A1 (enExample)
EP (1) EP4416232A1 (enExample)
JP (1) JP2024537888A (enExample)
CN (1) CN118103473A (enExample)
FR (1) FR3128224B1 (enExample)
WO (1) WO2023062324A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026109748A1 (fr) * 2024-11-22 2026-05-28 Arkema France Composition pour une structure multicouche à base de polyamide utilisable en tant que carte
FR3168791A1 (fr) * 2024-11-22 2026-05-29 Arkema France Structure multicouche à base de polyamide utilisable en tant que carte

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2671011A1 (en) * 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
US20120157600A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Molded thermoplastic articles comprising thermally conductive polymers
US8552101B2 (en) * 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
FR3023294B1 (fr) * 2014-07-01 2018-07-13 Arkema France Polyamides a base d'aminoalkyl- ou aminoaryl- piperazine pour adhesifs thermofusibles
CN104356998A (zh) * 2014-09-23 2015-02-18 苏州雷立特新材料科技有限公司 一种用于电子封装领域的聚酰胺热熔胶
ES2914973T3 (es) * 2015-03-05 2022-06-20 Henkel Ag & Co Kgaa Adhesivo termoconductor
CN105670550B (zh) * 2016-03-31 2017-11-14 东莞新能源科技有限公司 一种导热胶及含有该导热胶的二次电池
CN107880264B (zh) * 2017-12-06 2020-12-01 华南协同创新研究院 一种石墨烯改性聚酰胺导热热熔胶及其制备方法

Also Published As

Publication number Publication date
US20250236773A1 (en) 2025-07-24
CN118103473A (zh) 2024-05-28
WO2023062324A1 (fr) 2023-04-20
JP2024537888A (ja) 2024-10-16
FR3128224A1 (fr) 2023-04-21
EP4416232A1 (fr) 2024-08-21

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