JP2024537888A - ホットメルト接着剤組成物 - Google Patents

ホットメルト接着剤組成物 Download PDF

Info

Publication number
JP2024537888A
JP2024537888A JP2024522015A JP2024522015A JP2024537888A JP 2024537888 A JP2024537888 A JP 2024537888A JP 2024522015 A JP2024522015 A JP 2024522015A JP 2024522015 A JP2024522015 A JP 2024522015A JP 2024537888 A JP2024537888 A JP 2024537888A
Authority
JP
Japan
Prior art keywords
composition
filler
composition according
diamine
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024522015A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024537888A5 (enExample
Inventor
トマ プルヴェイール，
Original Assignee
ボスティク エス アー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ボスティク エス アー filed Critical ボスティク エス アー
Publication of JP2024537888A publication Critical patent/JP2024537888A/ja
Publication of JP2024537888A5 publication Critical patent/JP2024537888A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024522015A 2021-10-14 2022-10-13 ホットメルト接着剤組成物 Pending JP2024537888A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR2110895A FR3128224B1 (fr) 2021-10-14 2021-10-14 Composition Adhésive thermofusible
FR2110895 2021-10-14
PCT/FR2022/051930 WO2023062324A1 (fr) 2021-10-14 2022-10-13 Composition adhésive thermofusible

Publications (2)

Publication Number Publication Date
JP2024537888A true JP2024537888A (ja) 2024-10-16
JP2024537888A5 JP2024537888A5 (enExample) 2025-10-15

Family

ID=78770796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024522015A Pending JP2024537888A (ja) 2021-10-14 2022-10-13 ホットメルト接着剤組成物

Country Status (6)

Country Link
US (1) US20250236773A1 (enExample)
EP (1) EP4416232A1 (enExample)
JP (1) JP2024537888A (enExample)
CN (1) CN118103473A (enExample)
FR (1) FR3128224B1 (enExample)
WO (1) WO2023062324A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026109748A1 (fr) * 2024-11-22 2026-05-28 Arkema France Composition pour une structure multicouche à base de polyamide utilisable en tant que carte
FR3168791A1 (fr) * 2024-11-22 2026-05-29 Arkema France Structure multicouche à base de polyamide utilisable en tant que carte

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010511082A (ja) * 2006-11-29 2010-04-08 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン ホットメルト接着剤からの成形品
US20120228542A1 (en) * 2011-02-25 2012-09-13 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
JP2018510937A (ja) * 2015-03-05 2018-04-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 熱伝導性接着剤
JP2019035084A (ja) * 2014-07-01 2019-03-07 アルケマ フランス ホットメルト接着剤用のアミノアルキルピペラジン又はアミノアリールピペラジンをベースとしたポリアミド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120157600A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Molded thermoplastic articles comprising thermally conductive polymers
CN104356998A (zh) * 2014-09-23 2015-02-18 苏州雷立特新材料科技有限公司 一种用于电子封装领域的聚酰胺热熔胶
CN105670550B (zh) * 2016-03-31 2017-11-14 东莞新能源科技有限公司 一种导热胶及含有该导热胶的二次电池
CN107880264B (zh) * 2017-12-06 2020-12-01 华南协同创新研究院 一种石墨烯改性聚酰胺导热热熔胶及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010511082A (ja) * 2006-11-29 2010-04-08 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン ホットメルト接着剤からの成形品
US20120228542A1 (en) * 2011-02-25 2012-09-13 L Abee Roy Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
JP2019035084A (ja) * 2014-07-01 2019-03-07 アルケマ フランス ホットメルト接着剤用のアミノアルキルピペラジン又はアミノアリールピペラジンをベースとしたポリアミド
JP2018510937A (ja) * 2015-03-05 2018-04-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 熱伝導性接着剤

Also Published As

Publication number Publication date
US20250236773A1 (en) 2025-07-24
CN118103473A (zh) 2024-05-28
WO2023062324A1 (fr) 2023-04-20
FR3128224A1 (fr) 2023-04-21
EP4416232A1 (fr) 2024-08-21
FR3128224B1 (fr) 2024-11-29

Similar Documents

Publication Publication Date Title
JP3481730B2 (ja) ポリアミド組成物
CN102149748B (zh) 包含链末端的半芳族聚酰胺
JP3986889B2 (ja) ポリアミド組成物
CN103052686B (zh) 含有天然纤维的复合材料
JP3466330B2 (ja) ポリアミドおよびポリアミド組成物
JP6152383B2 (ja) ポリアミド樹脂組成物
JP6243706B2 (ja) ポリアミド樹脂
CN102666652B (zh) 半芳香族聚酰胺、其制备方法、包括这样的聚酰胺的组合物及其用途
JP2024536476A (ja) ホットメルト接着剤組成物
JP2023514116A (ja) 架橋された脂肪族ポリケトン
US20250236773A1 (en) Hot-melt adhesive composition
CN114409895A (zh) 半芳香族聚酰胺及制备方法和应用
CN112585217A (zh) 聚酰胺组合物
JPWO2020040191A1 (ja) ポリアミド組成物及び該ポリアミド組成物からなる成形品
CN105754331B (zh) 聚酰胺树脂组合物及成型体
JP2023024509A (ja) 防水部品およびそれを備えた電子機器、インサート成形体の防水方法ならびに電子機器の防水方法
JP6097203B2 (ja) ポリアミド樹脂組成物
CN116848176A (zh) 含有聚酰胺(pa)聚合物的粉状材料(p)及其用于增材制造的用途
JP5669627B2 (ja) ポリアミド樹脂組成物及び成形品
JP5669626B2 (ja) ポリアミド樹脂組成物及び成形品
JPWO2020040192A1 (ja) ポリアミド組成物及び該ポリアミド組成物からなる成形品
JP3549624B2 (ja) 熱可塑性樹脂組成物
JP6857708B2 (ja) ポリアミド樹脂組成物及び成形体
JP2000212437A (ja) ポリアミド組成物およびそれからなる成形品
CN105524458B (zh) 聚酰胺树脂组合物及成型体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251006

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251006

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20260625

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260707