JP2024536476A5 - - Google Patents
Info
- Publication number
- JP2024536476A5 JP2024536476A5 JP2024522016A JP2024522016A JP2024536476A5 JP 2024536476 A5 JP2024536476 A5 JP 2024536476A5 JP 2024522016 A JP2024522016 A JP 2024522016A JP 2024522016 A JP2024522016 A JP 2024522016A JP 2024536476 A5 JP2024536476 A5 JP 2024536476A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- composition
- diamine
- unit
- diacid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2110897 | 2021-10-14 | ||
| FR2110897A FR3128223B1 (fr) | 2021-10-14 | 2021-10-14 | Composition adhésive thermofusible |
| PCT/FR2022/051931 WO2023062325A1 (fr) | 2021-10-14 | 2022-10-13 | Composition adhésive thermofusible |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024536476A JP2024536476A (ja) | 2024-10-04 |
| JP2024536476A5 true JP2024536476A5 (enExample) | 2025-10-15 |
Family
ID=80225434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024522016A Pending JP2024536476A (ja) | 2021-10-14 | 2022-10-13 | ホットメルト接着剤組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240400872A1 (enExample) |
| EP (1) | EP4416231A1 (enExample) |
| JP (1) | JP2024536476A (enExample) |
| CN (1) | CN118103474A (enExample) |
| FR (1) | FR3128223B1 (enExample) |
| WO (1) | WO2023062325A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026109748A1 (fr) * | 2024-11-22 | 2026-05-28 | Arkema France | Composition pour une structure multicouche à base de polyamide utilisable en tant que carte |
| FR3168791A1 (fr) * | 2024-11-22 | 2026-05-29 | Arkema France | Structure multicouche à base de polyamide utilisable en tant que carte |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2776295B1 (fr) * | 1998-03-18 | 2000-06-23 | Trl | Polyamide thermofusible et reticulable, l'un de ses procedes d'obtention et colle le comprenant |
| CA2671011A1 (en) * | 2006-11-29 | 2008-06-05 | Henkel Ag & Co. Kgaa | Molded parts from hot melt adhesives |
| US20100032629A1 (en) * | 2008-08-07 | 2010-02-11 | Benoit Brule | Adhesive composition containing carbon nanotubes and a copolyamide |
| FR2934867A1 (fr) * | 2008-08-08 | 2010-02-12 | Arkema France | Utilisation d'une dispersion de nanotubes de carbone dans un copolyamide comme composition adhesive conductrice |
| FR2938843B1 (fr) * | 2008-11-27 | 2012-07-20 | Arkema France | Composition comportant un polymere thermoplastique et un graphite expanse |
| WO2015072428A1 (ja) * | 2013-11-12 | 2015-05-21 | Jnc株式会社 | ヒートシンク |
| FR3023294B1 (fr) * | 2014-07-01 | 2018-07-13 | Arkema France | Polyamides a base d'aminoalkyl- ou aminoaryl- piperazine pour adhesifs thermofusibles |
| FR3034771B1 (fr) * | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| CN105670550B (zh) * | 2016-03-31 | 2017-11-14 | 东莞新能源科技有限公司 | 一种导热胶及含有该导热胶的二次电池 |
| EP3236479A1 (en) * | 2016-04-21 | 2017-10-25 | Henkel AG & Co. KGaA | An electrically conductive, hot-melt adhesive or moulding composition |
| US20190131207A1 (en) * | 2016-05-10 | 2019-05-02 | Republic Polytechnic | A heat sink, a filler for a heat sink and methods thereof |
| JP6922248B2 (ja) * | 2017-02-21 | 2021-08-18 | 東洋インキScホールディングス株式会社 | ホットメルト接着剤組成物、および積層体 |
| FR3066196B1 (fr) * | 2017-05-11 | 2020-05-15 | Arkema France | Composition a base de peba et son utilisation pour la fabrication d'un objet transparent resistant a la fatigue |
-
2021
- 2021-10-14 FR FR2110897A patent/FR3128223B1/fr active Active
-
2022
- 2022-10-13 WO PCT/FR2022/051931 patent/WO2023062325A1/fr not_active Ceased
- 2022-10-13 CN CN202280069133.7A patent/CN118103474A/zh active Pending
- 2022-10-13 JP JP2024522016A patent/JP2024536476A/ja active Pending
- 2022-10-13 US US18/698,110 patent/US20240400872A1/en active Pending
- 2022-10-13 EP EP22801511.1A patent/EP4416231A1/fr active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102471482B (zh) | 基于含有对苯二甲酸和三甲基六亚甲基二胺单元的共聚酰胺的成型物料 | |
| JP2021521021A5 (enExample) | ||
| JP7121450B2 (ja) | ポリアミド6,6と高鎖長ポリアミドのブレンドとを含むポリアミド組成物、その使用、およびそれから得られる物品 | |
| BR112013009232A2 (pt) | composição de poliamida retardadora e artigo | |
| RU2011134243A (ru) | Полиамидные пленки для гибких печатных плат | |
| JP2024537888A5 (enExample) | ||
| WO2011097832A1 (zh) | 一种长碳链半芳香耐高温聚酰胺的均聚物和共聚物及其合成方法 | |
| JP2015071668A (ja) | ポリアミド樹脂組成物 | |
| US20150240079A1 (en) | Polyamide resin composition | |
| BR102014023478B1 (pt) | Composição de moldagem à base de uma copoliamida parcialmente aromática, e peça moldada | |
| JP2017061675A5 (enExample) | ||
| BR112013026001B1 (pt) | composição poliamida estabilizada | |
| US10544262B2 (en) | Polyamide | |
| CN112585217A (zh) | 聚酰胺组合物 | |
| CN105778493B (zh) | 聚酰胺树脂组合物及成型体 | |
| CN107298852B (zh) | 聚酰胺树脂组合物和成型体 | |
| JP2015105321A (ja) | ポリアミド10t延伸フィルム | |
| CN118103474A (zh) | 热熔胶粘剂组合物 | |
| CN118103473A (zh) | 热熔胶粘剂组合物 | |
| CN103910879A (zh) | 结晶聚酰胺酯树脂、其制备方法和由其生产的制品 | |
| KR101876604B1 (ko) | 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품 | |
| Lee et al. | Preparation and characterization of polyhydroxyamide hybrid nanocomposite films containing MWCNTs and clay as reinforcing materials | |
| JP2013539811A (ja) | 熱安定化ポリアミド組成物 | |
| CN103665372B (zh) | 一种半芳香族聚酰胺、其制备方法、其组合物及其应用 | |
| JP5458846B2 (ja) | 新規なポリアミド樹脂を含む電子写真用部材 |